Two-dimensional micro-self-assembly using the surface tension of water

Hosokawa, Kazuo; Shimoyama, Isao; Miura, Hirofumi

doi:10.1016/s0924-4247(97)80102-1

Cited by 94 publications

(47 citation statements)

References 5 publications

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“…For different applications, various lubricants have been developed including organic polymers [28] and alloy solder [16,29,30] in air, and the lubricant can be cured [14,15,18] or hardened by cooling [16] to permanently bond the parts (Figure 1.1.3 d). Water surrounded by air has been used [31][32][33] for experimental determination of the alignment accuracy. In the following section, we discuss the experimental details of the self-assembly process.…”

Section: Application To Self-alignmentmentioning

confidence: 99%

Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self‐Assembly of Microdevices

et al. 2003

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The parallel fluidic self-assembly of microdevices is a new technology that promises to speed up the production of complex microsystems made up of many separate parts. The technology brings many advantages. First, it enables a mix of chipmaking technologies for each of the component parts, with each technology selected for its particular technical or financial benefits. Second, it eliminates the need for pickand-place assembly that would unnecessarily slow down any manual assembly technique. Third, it enables massively parallel assembly, almost independent of the number of parts involved, and thereby mimics the elegant parallelism inherent in microchip circuit manufacture.In this chapter we explore this new technology with the ultimate goal of discovering the practical limits for its practical use in manufacturing real microsystems. The driving force of the assembly process is interface surface tension, and our approach is to find the simplest models that correctly describe the attachment, orientation, and bonding of parts to a suitably prepared substrate. We follow both an analytical and a numerical approach in describing the surface tension effects, the latter mainly to gain geometrical generality, and we couple modeling and simulation with suitable laboratory experiments. The ultimate goal of this work is to find practical design rules with which to select bond site geometries and the properties of participating liquids, and to find practical tolerances for all required geometrical and rheological parameters. This chapter extensively documents all results found to date, and carefully cites other work in this area.

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Section: Application To Self-alignmentmentioning

confidence: 99%

Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self‐Assembly of Microdevices

et al. 2003

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“…We and others have begun to examine patterned assembly and self-assembly as strategies for fabrication of devices made up of small components (3)(4)(5)(6)(7)(8)(9). These assembly methods are intrinsically parallel and have the potential for submicrometer accuracy in positioning.…”

mentioning

confidence: 99%

Fabrication of a Cylindrical Display by Patterned Assembly

Jacobs

Tao

Schwartz

et al. 2002

Science

361

289

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We demonstrate the patterned assembly of integrated semiconductor devices onto planar, flexible, and curved substrates on the basis of capillary interactions involving liquid solder. The substrates presented patterned, solder-coated areas that acted both as receptors for the components of the device during its assembly and as electrical connections during its operation. The components were suspended in water and agitated gently. Minimization of the free energy of the solder-water interface provided the driving force for the assembly. One hundred and thirteen GaAlAs light-emitting diodes with a chip size of 280 micrometers were fabricated into a prototype cylindrical display. It was also possible to assemble 1500 silicon cubes, on an area of 5 square centimeters, in less than 3 minutes, with a defect rate of ϳ2%.The assembly of individual devices into integrated systems is a key process in microelectronics and optics. The past three decades have produced a range of new manufacturing technologies focused on assembly: serial pick-and-place, serial wire-bonding, serial packaging, and parallel wafer-to-wafer transfer (1). Each has limitations: Pick-and-place is inefficient with large numbers of components and with components with dimensions of Ͻ100 m because adhesive forces often dominate gravitational forces (2). Both micromanipulator-based assembly and waferto-wafer transfer methods work poorly on nonplanar surfaces, in cavities, and in fabrication of three-dimensional (3D) systems. Serial processes, in general, are slow.We and others have begun to examine patterned assembly and self-assembly as strategies for fabrication of devices made up of small components (3-9). These assembly methods are intrinsically parallel and have the potential for submicrometer accuracy in positioning. They are relatively insensitive to certain types of errors in registration. Selfassembly has been studied extensively in chemistry and biology, and molecular selfassembly offers a rich menu of examples (10, 11) to use in designing processes that allow fabrication with components larger than molecules (12, 13).Previous demonstrations of patterned assembly to generate functional electrical devices include shape-directed fluidic methods that position electronic devices on plastic supports (14, 15), coplanar integration of segmented integrated circuit (IC) devices into 2D "super chips" by using capillary forces (16, 17), solder-based assembly that uses the surface tension between molten solder drops to fabricate 3D electrical networks (18), ring oscillators, and shift-registers (19). Processes based on the surface tension between solder drops and metallic surfaces have been used previously to assemble electronic and mechanical structures; examples include "flipchip" technology (20) and the rotation of parts of microstructures into nonplanar orientations (21,22).Here we focus on solder-based assembly to integrate device segments onto nonplanar substrates. The dimensions (ϳ300 m) of these components are 30 times smaller than those of previous s...

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“…One strategy toward attaining this goal emerges from the application of self-organization and assembly concepts that are ubiquitously present in the biological world and used successfully in supramolecular chemistry. Based on these principles several methods for the assembly of objects into two-and three-dimensional structures have been demonstrated at length scales from several nanometers up to millimeters (3)(4)(5)(6)(7)(8)(9)(10)(11). Most of these methods rely on shape complementarity of the objects, the surface tension at the interface of an auxiliary liquid and the object surfaces, and specific molecular interactions between the individual objects.…”

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confidence: 99%

Colloidal assemblies on patterned silane layers

Jonas

Campo

Krüger

et al. 2002

Proc. Natl. Acad. Sci. U.S.A.

116

122

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The site-selective assembly of colloidal polymer particles onto laterally patterned silane layers was studied as a model system for the object assembly process at mesoscale dimensions. The structured silane monolayers on silicon oxide substrates were fabricated by a combination of liquid-and gas-phase deposition of different trialkoxysilanes with a photolithographic patterning technique. By using this method various types of surface functionalizations such as regions with amino functions next to areas of the bare silica surface or positively charged regions of a quaternary ammonium silane surrounded by a hydrophobic octadecylsilane film could be obtained. Furthermore, a triethoxysilane with a photoprotected amino group was synthesized, which allowed direct photopatterning after monolayer preparation, leading to free NH2 groups at the irradiated regions. The different silane monolayer patterns were used to study the surface assembly behavior of carboxylated methacrylate particles by optical and scanning electron microscopy. In dependence of the assembly conditions (different surface functionalizations, pH, and drying conditions), a selective preference of the particles for a specific surface type versus others was found. Site-specific colloid adsorption could be observed also on the photosensitive silane layers after local deprotection with light. From the photosensitive silane and positively charged ammonium silane, molecularly mixed monolayers were prepared, which allowed particle adsorption and photoactivation within the same monolayer as shown by fluorescence labeling.O ne of the major driving forces in modern technology is based on the desire for miniaturization, which leads to smaller and lighter devices and a higher number of functional units per volume element. This tendency is prevalent particularly in microelectronics, optics, and sensors. Fabrication methods for small parts and structuring techniques have been developed very far, entering now the regime of nanoscopic dimensions (1, 2). Integrating individual objects of such dimensions into more complex structures and devices, on the other hand, represents a key challenge. Especially for the interfacing of nanoscopic devices with the macroscopic world, a large number of hierarchical organization levels are required to be implemented and controlled to actually use such small devices. One strategy toward attaining this goal emerges from the application of self-organization and assembly concepts that are ubiquitously present in the biological world and used successfully in supramolecular chemistry. Based on these principles several methods for the assembly of objects into two-and three-dimensional structures have been demonstrated at length scales from several nanometers up to millimeters (3-11). Most of these methods rely on shape complementarity of the objects, the surface tension at the interface of an auxiliary liquid and the object surfaces, and specific molecular interactions between the individual objects.A refined strategy for the assembly of mesos...

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Two-dimensional micro-self-assembly using the surface tension of water

Cited by 94 publications

References 5 publications

Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self‐Assembly of Microdevices

Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self‐Assembly of Microdevices

Fabrication of a Cylindrical Display by Patterned Assembly

Colloidal assemblies on patterned silane layers

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