Two-dimensional optical scanner with monolithically integrated glass microlens

Yoo, Seunghwa; Jin, Jong-Sik; Ha, Joon Geun; Ji, Chang-Hyeon; Kim, Yong Kweon

doi:10.1088/0960-1317/24/5/055009

Cited by 9 publications

(2 citation statements)

References 22 publications

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“…The fabricated optical windows were smaller than 0.75 mm × 0.75 mm with a yield higher than 95%. Except for the wide applications in fabricating optical caps [80], anodic bonding was also used for building a vacuum tight vapor cell for optogalvanic spectroscopies [81], microlens arrays [82], 3D microlens scanners [83,84], microfluidic-based optical detection systems [85], micro-optical magnetometers [86], and micro-optical choppers for Raman spectroscopies [87]. Figure 8.…”

Section: Anodic Bondingmentioning

confidence: 99%

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

Howlader

Deen

2015

Photonics

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Abstract:Silicon-based integrated systems are actively pursued for sensing and imaging applications. A major challenge to realize highly sensitive systems is the integration of electronic, optical, mechanical and fluidic, all on a common platform. Further, the interface quality between the tiny optoelectronic structures and the substrate for alignment and coupling of the signals significantly impacts the system's performance. These systems also have to be low-cost, densely integrated and compatible with current and future mainstream technologies for electronic-photonic integration. To address these issues, proper selection of the fabrication, integration and assembly technologies is needed. In this paper, wafer level bonding with advanced features such as surface activation and passive alignment for vertical electrical interconnections are identified as candidate technologies to integrate different electronics, optical and photonic components. Surface activated bonding, superior to other assembly methods, enables low-temperature nanoscaled component integration with high alignment accuracy, low electrical loss and high transparency of the interface. These features are preferred for the hybrid integration of silicon-based micro-opto-electronic systems. In future, new materials and assembly technologies may emerge to enhance the performance of these micro systems and reduce their cost. The article is a detailed review of bonding techniques for electronic, optical and photonic components in silicon-based systems.

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Section: Anodic Bondingmentioning

confidence: 99%

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

Howlader

Deen

2015

Photonics

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“…1c). Both configurations are enabled by discrete components, but the complexity of the scanner with movable lens is lower [8]. Even an elegant MEMS fiber scanning solution [9] does not exclude the need for complex microassembly procedures.…”

Section: Introductionmentioning

confidence: 99%

A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution

Jović

Uto

Hei

et al. 2018

2018 IEEE Micro Electro Mechanical Systems (MEMS)

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A highly miniaturized, single-chip, large scanning range MOEMS scanner is demonstrated. This intrinsically-aligned, monolithically integrated device uses small angular displacement to provide a linear scanning range of 2000 μm in the lateral and 1000 μm in the vertical direction, at a working distance of 2 cm, with an average operating power lower than 170 mW. Within a footprint of only 7×10 mm 2 , the presented system fully integrates a photonic interferometer comprising a mirror, a silicon microlens and the MEMS actuator into a single chip, thus offering an unprecedentedly miniaturized scanning solution. The monolithic integration of all photonic components provides intrinsic alignment and excludes coupling losses often encountered in systems composed of discrete parts. No additional attenuation of the optical signal is observed during device operation. This small and highperformance device is suitable as complete system-onchip for commercial, portable imaging applications.

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3D Nano‐Printed Bistable Microlens Actuator for Reconfigurable Micro‐Optical Systems

Calikoglu,

Lux,

Taege

et al. 2024

Adv Funct Materials

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The integration of multiple functional microscopy methods into a single, miniaturized instrument, known as multimodal endomicroscopy, presents significant challenges due to the often conflicting optical requirements of each imaging modality. In this study, the use of 3D nano‐printing based on two‐photon polymerization for the monolithic manufacturing of complete optical MEMS devices is investigated as an enabling platform for multimodal endoscopy. This approach offers unparalleled miniaturization, design flexibility, and alignment precision of micro‐optics and actuators. In particular, the design, fabrication, and characterization of a monolithically 3D nano‐printed bistable microlens actuator are discussed. Bistability allows the microlens to switch between two stable positions, thereby changing the focus distance and numerical aperture. The actuator features two coils with opposing current directions, which create a magnetic field gradient around a polymer micro‐magnet. This configuration allows for robust switching between stable positions with an average axial distance of 168.3 ± 7.3 µm. Experiments conducted to ascertain the optical characterization of the actuator demonstrate its capacity to transition between different optical modes. The beam widths are measured to be in the range of 4.1 ± 0.2 µm in the high‐resolution mode and 11.3 ± 1.1 µm in the extended depth of focus mode.

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Two-dimensional optical scanner with monolithically integrated glass microlens

Cited by 9 publications

References 22 publications

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution

3D Nano‐Printed Bistable Microlens Actuator for Reconfigurable Micro‐Optical Systems

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