Two-step polishing technique for single crystal diamond (100) substrate utilizing a chemical reaction with iron plate

Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing

“…Scientific investigation of the processes underlying diamond polishing has been performed for a long time. Up to now, diverse polishing techniques based on different physical and chemical principles have been introduced, e.g., (i) mechanical polishing with diamond powder [6], (ii) chemical-mechanical polishing [7][8][9], (iii) laser smoothing [10], (iv) plasma etching [11][12][13], (v) molten eutectic [14], (vi) ion beam smoothing [15][16], (vii) high rate ultrasonic polishing with slurry [5] and even (viii) multi-step processing [17]. However, most processes are either time-consuming or complicated, and some are incapable of achieving the ultra-smooth surface required.…”

“…Dynamic friction polishing (DFP) that integrates mechanical, thermal and chemical interactions has been developed in recent decades [17][18][19][20][21]. This procedure is based on the carbon dissolution in a metal wheel or can be considered as the catalytic action of such a wheel by high speed polishing, owing to the high temperature obtained by the workpiece during polishing [5,[17][18][19].…”

New material for anti-wear corrosion-resistant coating of agro industrial complex machinery parts

“…Due to the high hardness of the coating, the existing methods of grinding and finishing [1][2][3][4] did not provide the required surface roughness, which should be Ra 0.04 and at which the graphite particle and all other coating particles with poor adhesion are removed. Therefore, they are replaced by other methods, the most promising of which is the method of thermochemical treatment [5][6][7][8].…”

Atom-by-Atom and Sheet-by-Sheet Chemical Mechanical Polishing of Diamond Assisted by OH Radicals: A Tight-Binding Quantum Chemical Molecular Dynamics Simulation Study

“…Besides oxidizing salt solutions, OH radicals have been reported to improve the CMP efficiency and surface flatness for diamond. Kubota et al proposed a novel OH-radical-assisted CMP system for diamond that displayed very high CMP efficiency and good surface flatness. − In this system, OH radicals are generated on a metal catalyst plate through chemical reactions with H 2 O 2 solution. When a nickel plate is used, they successfully obtained the atomically planar diamond surface (roughness of <0.1 nm) and high removal rate of 216.7 nm/h assisted by the generated OH radicals.…”