ULSI and Thin Film Semiconductor Technologies: Evolution of Industry and Research Linked to Higher Education in France

Abstract

This paper discusses the evolution since the early 1980s of microelectronics applied to integrated circuits (ULSI) and large surface electronics (TFT) in France, both in industry and in academic institutions. This strategy is the result of the French government's policy to support the development of industry and higher education. The objective was to provide industry with future technicians, engineers, masters and doctors with the knowledge, know-how and capacity to develop this field as in advanced countries. More recently, a new government plan has been initiated to develop connected objects and the Internet of Things, mandatory for the emerging digital society. These correspond to the combination of ULSI and TFT technologies. After a synthetic presentation of the evolution of the industrial and academic environment, the paper highlights the evolution of the two main technologies as well as the strategy developed by the French educational community based on innovation and enabling it to bring know-how and skills in this field.

(Invited) Progressive Involvement of Thin Film Technologies in Connected Objects to Meet New Societal Challenges

“…All materials are also concerned in order to meet the needs of temperature sensitivity reduction and leakage current lowering. Thus, highly integrated silicon-based technologies but also all deposited thin film technologies are concerned [8]! As a consequence, the task is vast, the challenges are important and the whole world microelectronics community must be involved.…”

“…The main challenges will therefore focus on reducing the consumption of electronic functions including sensors and actuators [6][7], signal conversion and processing devices, energy collection and storage devices, display panels and short-and long-distance communication systems [8]. This development involves new technological approaches including very highly integrated components and circuits (ULSI or Ultra-Large Scale-Integration) but also thin film technologies based on inorganic and organic materials.…”

“…Particular attention will be paid to the energy consumption of components and circuits which induce an exponentially increasing consumption of connected objects and the Internet. The next part will focus on the different approaches envisaged and more particularly on thin-film devices, either integrated or large-area [8]. In order to complete the picture, the last part will focus on the human needs in skills and know-how by giving as an example the strategy of the French microelectronics training network carried out over the last ten years [9].…”

“…The final objective is to take up the technological and human challenges within the framework of the French electronics sector, set up in 2019 by the French Government [16], which aims to make a significant contribution at the international level to the development of the digital society involving the Internet of Things, artificial intelligence (IA) and Industry 4.0. The end of the document will briefly present the organization of training in France in the field of microelectronics within the framework of a national network for training in microelectronics (GIP-CNFM) [17][18], which has developed a strategy of creating innovative technological platforms for the training of technicians, engineers and doctors, implementing new technologies and manufacturing processes, especially thin-film technologies [8].…”