1988
DOI: 10.1109/16.3334
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Ultimate scaling limits for high-frequency GaAs MESFETs

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Cited by 18 publications
(3 citation statements)
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“…However, only the four most relevant sets are provided here for comparison. The design variables are chosen based on the scaling rules stated in [16]. The materials being employed are Si, GaAs, and InP for the backilluminated OPFET device with the gate electrodes being Indium-Tin-Oxide (ITO) for Si and GaAs, and gold (Au) for InP.…”
Section: Resultsmentioning
confidence: 99%
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“…However, only the four most relevant sets are provided here for comparison. The design variables are chosen based on the scaling rules stated in [16]. The materials being employed are Si, GaAs, and InP for the backilluminated OPFET device with the gate electrodes being Indium-Tin-Oxide (ITO) for Si and GaAs, and gold (Au) for InP.…”
Section: Resultsmentioning
confidence: 99%
“…At the lowest gate length under consideration of 3 μm and the highest doping concentration of 5×10 22 /m 3 (gate length-doping concentration product is constant from scaling rules [16]) with an active layer thickness of 0.15 μm, the OPFET devices exhibit the lowest dark and photocurrents among all the sets. This is ascribed to the very less active-layer thickness, as well as the low gate length and the gate width along with the reduced sensitivity at the higher doping concentrations.…”
Section: Series Resistance and Photovoltage Analysis In Si Inp And Gaas Opfetsmentioning
confidence: 99%
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