Ultra-compact RF passive components employing periodically arrayed ground structure on silicon RFIC

Highly Miniaturized 1-4 On-Chip PowerDivider/Combiner Circuit on Silicon Substrate forApplication to Long Distance Wireless PowerTransmission

“…6 shows the PAGS structure [14], [15]. According to our previous report [14], [15], the transmission line employing PAGS showed slow-wave characteristics, and the wavelength of the transmission line employing PAGS was reduced to 60~65% of conventional one, which enables a miniaturization. Its size was 1.08 X 0.63 mm 2 , which is 0.14% of the size of the conventional power divider/combiner fabricated on PCB (The size of the conventional power divider/combiner fabricated on PCB is 25 X 20 mm 2 Silicon sub.…”

Highly Miniaturized 1-4 On-Chip Power Divider/Combiner Circuit on Silicon Substrate for Application to Long Distance Wireless Power Transmission

“…6 shows the PAGS structure [14], [15]. According to our previous report [14], [15], the transmission line employing PAGS showed slow-wave characteristics, and the wavelength of the transmission line employing PAGS was reduced to 60~65% of conventional one, which enables a miniaturization. Its size was 1.08 X 0.63 mm 2 , which is 0.14% of the size of the conventional power divider/combiner fabricated on PCB (The size of the conventional power divider/combiner fabricated on PCB is 25 X 20 mm 2 .)…”

“…Fig. 6 shows the PAGS structure [14], [15]. According to our previous report [14], [15], the transmission line employing PAGS showed slow-wave characteristics, and the wavelength of the transmission line employing PAGS was reduced to 60~65% of conventional one, which enables a miniaturization.…”

“…Fig. 5 shows a structure of the 1 to 4 power divider/combiner employing PAGS (Periodically Arrayed Ground Strip) structure [14], [15] on silicon substrate. As shown in this figure, the power divider/combiner consists of the transmission line employing PAGS.…”