Ultra-High Density, Thin-Film Tantalum Capacitors with Improved Frequency Characteristics for MHz Switching Power Converters

Spurney, Robert G.; Sharma, Himani; Pulugurtha, Markondeya Raj; Tummala, Rao; Lollis, Naomi; Weaver, Mitch; Gandhi, Saumya; Romig, Matt; Brumm, Holger

doi:10.1007/s11664-018-6466-4

Cited by 6 publications

(1 citation statement)

References 9 publications

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“…Uno de los 4 indicadores más importantes es la resistencia en serie (ESR), (Spurney et al, 2018), resalta que "a una mayor densidad del ánodo mantiene un nivel bajo de (ESR)", esto nos ayuda a entender que podemos trabajar a partir de un nivel de densidad especifico.…”

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Optimización de materia prima en la industria de capacitores

Cuesta

Ocegueda²,

Velázquez³

2022

Ciencia Latina

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Esta investigación tiene como objetivo analizar la factibilidad de reemplazar la materia prima por otra con menor costo, manteniendo la calidad del capacitor. Horacek (et al., 2016) mencionan “que la tecnología de capacitores de tantalio tiene muchas características tales como: bajo y estable resistencia en serie equivalente, alta retención de capacitancia, una baja tasa de fallas, resistencia al ambiente (humedad, temperatura) y bajo costo”. Para probar estos indicadores se realizó una prueba de hipótesis de dos muestras para verificar la calidad del producto. Se llegó a la conclusión de que la materia prima era aceptable, cumpliendo con la capacitancia, resistencia, fuga de corriente y factor de disipación 4 indicadores mejorando la calidad del producto anterior.

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unclassified

Optimización de materia prima en la industria de capacitores

Cuesta

Ocegueda²,

Velázquez³

2022

Ciencia Latina

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An Ultra‐Thin, Ultra‐High Capacitance Density Tantalum Capacitor for 3D Packaging

Zhao

Hou

et al. 2023

Adv Materials Technologies

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Although embedded capacitors have been applied and researched for many years, their large‐scale application still faces challenges such as low capacitance density, high thickness, high cost, and incompatibility with integrated processes. In this work, a breakthrough has been made in the fabrication of ultra‐thin tantalum (Ta) capacitors with ultra‐high capacitance density that can be used for 3D packaging. The key to these excellent performances is the application of Ta foil with nano‐porous structure to the anode of the capacitor. The Ta foil with high specific surface area (SSA) is successfully prepared by direct current pulse etching. At a current density of 15 mA cm−2, a pulse frequency of 50 Hz, and a duty cycle of 30%, the SSA of Ta foil is increased by 76 times after etching in an electrolyte with 0.01 v% TOA for 30 min. Based on this, Ta capacitors with a form factor of less than 40 µm, showing a capacitance density of 750 nF mm−2 and a leakage current of less than 2.1 × 10−7 A at 8 V is successfully fabricated. To the best of the authors’ knowledge, this is the highest capacitance density reported to date for the mentioned form factors.

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