2009
DOI: 10.1166/jnn.2009.384
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Ultra-Low-<I>k</I> Thin Films of Polyhedral Oligomeric Silsesquioxane/Epoxy Nanocomposites via Covalent Layer-by-Layer Assembly

Abstract: Polyhedral oligomeric silsesquioxane nanocomposites thin films on silicon surfaces were prepared by covalent layer-by-layer (LbL) assembly using octakis(glycidyldimethylsiloxy)octasilsesquioxane (OG-POSS) and 4,4(hexafluoroisopropylidene)dianiline (HID) as building blocks. The layer thickness increased linearly with the layer numbers. An ultra-low dielectric constant of approximately 1.57 was found with the LbL thin film. A novel approach to fabricate ultra low-k materials is demonstrated.

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Cited by 6 publications
(1 citation statement)
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“…Even though epoxy resins are usually dissolved in organic solvents, they can also be used for the covalent coupling with water-soluble compounds including biological ones . Epoxy-based components have already been used in Layer-by-Layer assembled films. , Oligo- or polymeric amines have previously been used for the assembly of LbL-films, whereas the second component, oligo- or polymeric epoxy derivatives, have only be sparsely been used in this context. In combination, both components ensure the formation of densely cross-linked materials, some of whose properties are controlled by the curing temperature.…”
mentioning
confidence: 99%
“…Even though epoxy resins are usually dissolved in organic solvents, they can also be used for the covalent coupling with water-soluble compounds including biological ones . Epoxy-based components have already been used in Layer-by-Layer assembled films. , Oligo- or polymeric amines have previously been used for the assembly of LbL-films, whereas the second component, oligo- or polymeric epoxy derivatives, have only be sparsely been used in this context. In combination, both components ensure the formation of densely cross-linked materials, some of whose properties are controlled by the curing temperature.…”
mentioning
confidence: 99%