Ultra low-profile self-matched SAW duplexer with a flip-chip HTCC package for W-CDMA 2100 mobile applications

Koch, Robert de Mello; Schwab, M.; Pitschi, F.M.; Kiwitt, J.E.; Weigel, Robert

doi:10.1109/mwsym.2009.5165641

Cited by 8 publications

(2 citation statements)

References 11 publications

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“…Therefore, the design of such duplexers is very challenging. It can be done by precise electromagnetic modeling of the component [23]. We used the extended CSSP3 technology to realize a prototypical band I SAW duplexer with an 2520 HTCC package.…”

Section: A Fully Matched Duplexersmentioning

confidence: 99%

High performance microwave acoustic components for mobile radios

Pitschi¹,

Kiwitt²,

Koch³

et al. 2009

2009 IEEE International Ultrasonics Symposium

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Due to their outstanding characteristics acoustic components, such as SAW and -later on -also BAW filters, have been key components in wireless communication systems from their very beginning. Regarding mobile radio handsets the primary field of application of acoustic components has moved to the RF front-end sections. Here, with the increasing demand for WCDMA-FDD capable mobile phones, duplexers, which allow to separate the TX and RX paths while being simultaneously connected to the antenna, have become indispensable.Regarding the specifications of the different operating bands the requirements on form factors, pass band characteristics, attenuations of the other signals (TX, RX, GPS, WLAN, . . . ), and isolations make them high performance components requiring a sophisticated acoustic as well as electromagnetic design. Due to the tough requirements imposed on the duplexers in terms of, e.g., center frequencies, spacings of RX and TX bands, relative band widths, and shape factors, they also require application-specific acoustic structures.As a consequence, in contrast to standard filters, duplexers are highly optimized components using leading-edge technologies. In order to achieve the best balance of the characteristic properties of the acoustic structures regarding, for instance, their quality factors, pole-zero distances, and temperature coefficients, the manufacturing processes of the acoustic chips are designed for the specific applications. Furthermore, optimizing the electrical characteristics a co-design of package and acoustic chip is applied.In this paper we provide an overview of the different types of duplexers that have been the result of the focused specialization and optimization efforts. We classify them according to the type of acoustic structures, matching circuitry, and package being used. So far, purely SAW-based and BAW-based duplexers as well as hybrid duplexers using both SAW and BAW chips have been reported. Most of the matching circuitry is integrated in, for instance, an LTCC package using a distributed approach based on a λ/4 line or a lumped approach comprising coils and/or capacitors. Sometimes the matching circuitry is realized externally on the PCB. Furthermore, we present recent integration successes, i.e., duplexer inserts, allowing the seamless integration of duplexers into modules without drawbacks on performance or module thickness.

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Section: A Fully Matched Duplexersmentioning

confidence: 99%

High performance microwave acoustic components for mobile radios

Pitschi¹,

Kiwitt²,

Koch³

et al. 2009

2009 IEEE International Ultrasonics Symposium

Self Cite

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“…Since SAW filters have a superior filter functionality and a small size, they play an important role in the evolution of mobile phones. The reduction in size of SAW filters has made a major contribution to the miniaturisation of mobile phones and to extending their functionality (2)(3)(4). Several billion SAW filters are now produced per year, more than any other Micro-Electro-Mechanical (MEMS) component.…”

Section: Introductionmentioning

confidence: 99%

Adhesive Wafer Bonding Applied for Fabrication of True-Chip-Size Packages for SAW Devices

Heuser¹,

Bauer²,

Dragoi³

et al. 2013

ECS Trans.

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Surface Acoustic Wave (SAW) filters are key components for mobile communication. In SAW devices mechanical waves propagate on the surface of a piezoelectric bulk material such as LiNbO3 or LiTaO3. SAW components require advanced cavity packaging solutions in order to enable the mechanical wave propagation on the substrate material. Size reduction of SAW filters allows further miniaturization of mobile phones and an extension of their functionality. The mobile communication industry, therefore, demands advanced cavity package technologies to be developed for SAW components. These packages have to offer high performance, high reliability, and low cost while maintaining a form factor as small as possible. To address these requirements EPCOS has developed a Die Sized SAW Package (DSSP), a true chip-size wafer level package for SAW filters. This paper discusses the manufacturing process of wafer-level-packages for SAW-devices with a special focus on the adhesive wafer bonding technology.

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Chip Size Packaging (CSP) for RF MEMS Devices

Xiao¹,

2017

RF and Microwave Microelectronics Packaging II

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Ultra low-profile self-matched SAW duplexer with a flip-chip HTCC package for W-CDMA 2100 mobile applications

Cited by 8 publications

References 11 publications

High performance microwave acoustic components for mobile radios

High performance microwave acoustic components for mobile radios

Adhesive Wafer Bonding Applied for Fabrication of True-Chip-Size Packages for SAW Devices

Chip Size Packaging (CSP) for RF MEMS Devices

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