2022
DOI: 10.1002/adfm.202109794
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Ultra‐Sensitive Cubic‐ITO/Silicon Photodiode via Interface Engineering of Native SiOx and Lattice‐Strain‐Assisted Atomic Oxidation

Abstract: A highly orientated cubic indium tin oxide (c‐ITO)/native SiOx/n‐Si Schottky photodiode with negligible electronic noise is demonstrated. This extraordinary property is achieved via simple interface engineering, which combines native SiOx, facile air‐annealing, and the resulting ITO‐lattice‐strain‐assisted oxidation of proximal underlying Si atoms. An exceptionally well‐passivated ITO/n‐Si interface is realized, which leads to a heretofore unreported single‐atom‐thin inversion layer observed via transmission e… Show more

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Cited by 7 publications
(7 citation statements)
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“…Interestingly, during the reactive sputtering of the MPL, energetic oxygen atoms bombard into native SiO x and additionally oxidize a few layers of Si atoms in the immediate proximity of the native SiO x /p ++ -Si interface. This is confirmed by the increased oxide thickness (∼4.7 nm; Figure f) and a greater brightness contrast against the pristine SiO x layer, which is attributable to strong negative charging during the plasma oxidation . As illustrated in Figure g, the atomic oxidation of the underlying Si atoms contribute to the creation of a high-quality interface where extant defects are either minimized or eliminated by the advancing SiO x –Si interface, which plays an important role for excellent tunneling behaviors in the PM-ATM, as discussed below.…”
Section: Resultsmentioning
confidence: 99%
“…Interestingly, during the reactive sputtering of the MPL, energetic oxygen atoms bombard into native SiO x and additionally oxidize a few layers of Si atoms in the immediate proximity of the native SiO x /p ++ -Si interface. This is confirmed by the increased oxide thickness (∼4.7 nm; Figure f) and a greater brightness contrast against the pristine SiO x layer, which is attributable to strong negative charging during the plasma oxidation . As illustrated in Figure g, the atomic oxidation of the underlying Si atoms contribute to the creation of a high-quality interface where extant defects are either minimized or eliminated by the advancing SiO x –Si interface, which plays an important role for excellent tunneling behaviors in the PM-ATM, as discussed below.…”
Section: Resultsmentioning
confidence: 99%
“…The wide depletion region (space charge region) and the electric field tailing region (weak field region) in this device serve to rapidly sweep and effectively extract the charge carriers. Additionally, the strong near‐surface electric field strength induced by the Schottky contact, and the proper interfacial chemical passivation effect associated with the native‐oxide‐based air‐annealing process, [ 22 ] remarkably mitigate photocarrier loss to surface recombination. Cross‐sectional SEM images for bare nanostalagmite structures are shown in Figure 1f (low magnification) and Figure 1g (high magnification).…”
Section: Resultsmentioning
confidence: 99%
“…Notably, during annealing in the air, oxygen diffuses into the Si sub‐surface, thereby oxidizing a few atomic layers of Si and creating a high‐quality interface between the nc ‐ITO and underlying SiO x ‐Si. [ 22 ] This interfacial oxidation is examined in the sidewall region as shown in Figure 2g: ≈2 nm SiO x is grown between the nc ‐ITO and nanostalagmite. The presented TEM image reveals that the native oxide attaches to the textured surface conformally.…”
Section: Resultsmentioning
confidence: 99%
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“…[ 112–133 ] d) Measured Schottky barrier heights of different TCOs, CBMs, and TMOs. [ 134–141 ] X‐ray photoelectron spectroscopy (XPS) spectra of e) nondoped, f) V‐doped, and g) Nb‐doped MoO 3− x films. Reproduced with permission.…”
Section: Characterization Of Dfpc Materials With Key Parametersmentioning
confidence: 99%