Ultrafast laser micromachining of 3C-SiC thin films for MEMS device fabrication

Pecholt, Ben; Vendan, Monica; Dong, Yuanyuan; Molian, Pal

doi:10.1007/s00170-007-1223-5

Cited by 80 publications

(30 citation statements)

References 52 publications

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“…According to the literature [4,12,22,[34][35][36][37], the interaction mechanism of ultrafast pulsed laser with material mainly includes common melting, ultrafast melting, thermal vaporization, coulomb explosion, phase explosion, avalanche ionization, and multiphoton ionization. However, the material removal process actually involves the combined effects of multiple mechanisms, which are difficult to distinguish clearly.…”

Section: Division Of Ablation Areamentioning

confidence: 99%

“…This value is the ablation threshold. Currently, three main methods are used to determine the material ablation threshold [4,12,22,37]. First method is morphological observation, which helps to examine the existence of permanent damage by observing the surface morphology with a microscope.…”

Section: Determination Of Ablation Thresholdmentioning

confidence: 99%

“…Higher laser energy leads to more accumulation of photon energy. Thus the influence of mechanism of interaction of laser with material such as coulomb explosion, phase explosion, avalanche ionization, and multiphoton ionization is more obvious, resulting in more free-carrier plasmas [4,12,22,[34][35][36][37]. The interaction of the coulomb repulsion with each plasma is difficult to completely splash them out, which results in more severe deposition of the material in the surrounding area of the crater and formation of an uneven ablation morphology and poorer crater roundness.…”

Section: Ablation Morphological Characteristicsmentioning

confidence: 99%

“…It is an important characteristic parameter dependent on the type of material, laser pulse duration, and wavelength in practical applications and has become an active research hotspot. Ablation threshold is ideally defined as the required minimum energy flux density at which irreversible permanent damage occurs on the material by the removal of a monolayer of material, which is referred to as the critical energy or power density values of the incident laser for the material being ablated [4,12]. So far, ultrafast pulsed laser ablation thresholds of several typical materials have been investigated.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Surface ablation and threshold determination of AlCu4SiMg aluminum alloy in picosecond pulsed laser micromachining

Zheng

Jiang

Wang

et al. 2017

Optics & Laser Technology

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Section: Division Of Ablation Areamentioning

confidence: 99%

Section: Determination Of Ablation Thresholdmentioning

confidence: 99%

Section: Ablation Morphological Characteristicsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Surface ablation and threshold determination of AlCu4SiMg aluminum alloy in picosecond pulsed laser micromachining

Zheng

Jiang

Wang

et al. 2017

Optics & Laser Technology

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“…So, shorter pulse duration lasers (nanoseconds to femtoseconds) are used for high precision industrial applications. Femtosecond lasers have produced little contamination and low HAZ due to short beam material interaction time [16]. However, the femtosecond laser micromachining system is costly and machining rates are low compared to nanosecond laser.…”

Section: Introductionmentioning

confidence: 99%

Experimental investigation of underwater laser beam micromachining (UW-LBμM) on 304 stainless steel

Behera

Sankar

Swaminathan

et al. 2016

Int J Adv Manuf Technol

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Fabrication of miniaturized components provides a challenge to the manufacturing industries and to meet the challenges many unconventional machining methods are developed, among which laser beam micromachining (LBμM) is one. But, thermal effects such as recast layer, heat-affected zone (HAZ), debris, and thermal cracks are commonly observed in LBμM. So, in order to minimize the thermal effects, underwater laser beam micromachining (UW-LBμM) came into existence. In this paper, experiment on UW-LBμM is reported using a Q-switched Nd:YAG laser for fabricating microchannels on 304 stainless steel. The effect of input process parameters (scanning speed, number of scan, laser pulse energy) on output responses (kerf width, kerf depth, surface roughness) of microchannel is studied. Laser micromachined channels are characterized by using optical microscopy, surface profilometer, scanning electron microscopy, and energy dispersive X-ray spectroscopy. It is observed that the dimensions of kerf width and kerf depth are low at lower number of scan, laser pulse energy, and higher scanning speed. The surface roughness decreases with decrease in number of scan and increase in laser pulse energy. Minimum surface roughness is achieved at scanning speed of 300 μm/s. The recast layer and debris are minimum during UW-LBμM compared to LBμM. Elemental comparison is carried out inside and in the surroundings of microchannel.

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Femtosecond Laser Fabrication of Microchannels in Transparent Hard Materials

Wang

et al. 2023

Adv Materials Technologies

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The excellent characteristics of transparent hard materials such as high hardness, high transparency, corrosion resistance, and high temperature resistance enable their applications in microfluidic substrates even in harsh environments. Microchannels are important parts in microfluidic systems, and the preparation of microchannel structures in transparent hard materials deserves further in‐depth study. The traditional processing method is contact processing with large thermal influence and low processing efficiency, so it is impossible to obtain complex microchannels with high quality and high aspect ratio. The femtosecond laser processing is a non‐contact processing approach with no thermal damage, high processing accuracy, and easy to form complex microchannels, making it the best choice for processing microchannels in transparent hard materials. This work reviews the recent advances in femtosecond laser processing of transparent hard materials to form microchannel structures, focusing on the reaction mechanism, processing methods, and the obtained microchannel structures, including surface microchannels, 2D microchannels, and 3D microchannels. Furthermore, the application of microchannel structure in microfluidic field, including optical inspection and biochemical reaction, is also described.

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Ultrafast laser micromachining of 3C-SiC thin films for MEMS device fabrication

Cited by 80 publications

References 52 publications

Surface ablation and threshold determination of AlCu4SiMg aluminum alloy in picosecond pulsed laser micromachining

Surface ablation and threshold determination of AlCu4SiMg aluminum alloy in picosecond pulsed laser micromachining

Experimental investigation of underwater laser beam micromachining (UW-LBμM) on 304 stainless steel

Femtosecond Laser Fabrication of Microchannels in Transparent Hard Materials

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