2020
DOI: 10.48550/arxiv.2010.12090
|View full text |Cite
Preprint
|
Sign up to set email alerts
|

Ultrahigh Vacuum Packaging and Surface Cleaning for Quantum Devices

M. Mergenthaler,
S. Paredes,
P. Müller
et al.

Abstract: We describe design, implementation and performance of an ultra-high vacuum (UHV) package for superconducting qubit chips or other surface sensitive quantum devices. The UHV loading procedure allows for annealing, ultra-violet light irradiation, ion milling and surface passivation of quantum devices before sealing them into a measurement package. The package retains vacuum during the transfer to cryogenic temperatures by active pumping with a titanium getter layer. We characterize the treatment capabilities of … Show more

Help me understand this report
View published versions

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2021
2021
2021
2021

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 13 publications
0
1
0
Order By: Relevance
“…While the loss tangent of Nb oxide has been studied [22], [23], the contribution of these components to the microwave loss and their evolution during oxide growth is poorly understood. Furthermore, limited strategies for mitigating the losses have been explored [24].…”
Section: Introductionmentioning
confidence: 99%
“…While the loss tangent of Nb oxide has been studied [22], [23], the contribution of these components to the microwave loss and their evolution during oxide growth is poorly understood. Furthermore, limited strategies for mitigating the losses have been explored [24].…”
Section: Introductionmentioning
confidence: 99%