2017
DOI: 10.1016/j.compscitech.2016.12.030
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Ultralow content silver densely-coated glass microsphere for high performance conducting polymer-matrix composites

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Cited by 27 publications
(16 citation statements)
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“…In the reaction, NaOH played an important role in the growth rate of nickel nanoparticles. Generally, the higher the concentration of NaOH, the faster the growth of nickel nanoparticles according to the previous research. It is found that the optimum concentration of NaOH was 0.75 M. Besides, temperature was another important factor of the electroless plating reaction. The reaction rate was very slow when the temperature was lower than 90 °C.…”
Section: Results and Discussionmentioning
confidence: 87%
“…In the reaction, NaOH played an important role in the growth rate of nickel nanoparticles. Generally, the higher the concentration of NaOH, the faster the growth of nickel nanoparticles according to the previous research. It is found that the optimum concentration of NaOH was 0.75 M. Besides, temperature was another important factor of the electroless plating reaction. The reaction rate was very slow when the temperature was lower than 90 °C.…”
Section: Results and Discussionmentioning
confidence: 87%
“…Besides the combination of these advantages stemming from their single-component counterparts, the property of core-shell hybrid nanoparticles can be tailored by adjusting their core-to-shell ratio. 107 To date, researchers have prepared many different types of core-shell composite particles, such as AgNP-coated Fe 3 O 4 nanoparticles, 108 AgNP-coated glass fibers, 109,110 AgNP-coated FeNi nanoparticles, 111 AgNP-coated hollow glass microspheres (HGM), 112,113 AgNP-coated SiO 2 /Ni, 114 Ag-coated fly ash, 115 AgNP-coated carbonyl iron powders, 116 AgNPcoated Spirulina cells, 117 and AgNP-coated CNTs. 118,119 via a simple electroless deposition technique or chemical reduction.…”
Section: Agnp Deposition On Polymer Microspheres or Fibersmentioning
confidence: 99%
“…In recent times, electromagnetic interference (EMI) pollution has worsened worldwide owing to the rapid growth of wireless communication devices, especially the arrival of the 5G era. [1][2][3] To eliminate EMI pollution, the design and fabrication of highperformance EMI shielding materials are of great signicance. 4,5 Compared with metal materials, conductive polymer composites (CPCs), consisting of polymers and conductive llers, are the best candidates as EMI shielding materials because of their intrinsic properties, such as exibility, easy processing, low cost, and anticorrosion.…”
Section: Introductionmentioning
confidence: 99%