Ultrarapid formation of multi-phase reinforced joints of hypereutectic Al-Si alloys via an ultrasound-induced liquid phase method using Sn-51In interlayer

Lin, Zhu; Wang, Qian; Shi, Lei; Zhang, Xin; Yang, Tié; Yan, Jiuchun; Zhou, Xiaoshu; Chen, Shengyong

doi:10.1016/j.msea.2017.11.014

Cited by 16 publications

(9 citation statements)

References 35 publications

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“…In-based solders are used in the electronics industry as a substitute for banned Pb-based solders. The authors of this work [18] examined the issues of soldering Al-Si alloys using a solder of high indium content with ultrasound assistance. They studied the formation of multi-phase reinforced bonds when soldering with a Sn51In solder.…”

Section: Introductionmentioning

confidence: 99%

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Koleňák

Kostolný

Drápala³

et al. 2018

Metals

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The aim of the research was to characterize the soldering alloy In-Ag-Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 • C. The solder microstructure is composed of a matrix with solid solution (In), in which the phases of titanium (Ti 3 In 4) and silver (AgIn 2) are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide-SiTi and titanium carbide-C 5 Ti 8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase-(CuAg) 6 In 5 and (AgCu)In 2. The average shear strength of a combined joint of SiC-Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In-Ag-Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

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Section: Introductionmentioning

confidence: 99%

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Koleňák

Kostolný

Drápala³

et al. 2018

Metals

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“…The Sn/Al interfaces are curved with some dissolution pits formed on the Al substrate surface. This indicates that ultrasound-induced acoustic cavitation effects have formed in the soldering seam, which result in the removal of oxide films from the Al substrate surfaces and the erosion of the Al substrate into the Sn matrix [6,7]. Some α-Al particles are found in the solder seam, the larger of which have a faceted shape.…”

Section: Microstructure Of Jointsmentioning

confidence: 98%

“…Ultrasonic-assisted low temperature soldering of Al alloys using Sn-based solders has germinated tremendous research enthusiasm for meeting the growing application requirement of Al alloys [5][6][7][8]. Acoustic cavitations induced by ultrasonic waves in a liquid medium can create extremely high temperature and pressure locally on a solid substrate surface [9,10].…”

Section: Introductionmentioning

confidence: 99%

“…The oxide films on Al substrates can be removed effectively under the action of these acoustic cavitations, and thus the ultrasonic-assisted low temperature soldering of Al alloys has been achieved even without the use of flux [7,11]. However, despite the potential of ultrasonic-assisted low temperature soldering of Al alloys shown in previous studies [6,8], little attention was paid to the underlying bonding mechanism between the Sn based solder and the Al substrate. In fact, the Sn and Al couple has low mutual solid solubility and no interfacial reaction compounds (IMCs) form on the Al-Sn phase diagram [12].…”

Section: Introductionmentioning

confidence: 99%

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Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

Xiao

Song

Shan

et al. 2020

Materials Science and Engineering: A

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Ni-foam reinforced Sn-based composite solder was employed to join ultrafine grain 7075 Al alloy with the assistance of ultrasound. The solder seam was mainly composed of Ni skeletons, Sn-based solder, α-Al phase and very fine (hundreds of nanometers to several microns diameter) Ni3Sn4 particles. Discontinuous networks surrounded by the fine Ni3Sn4 and α-Al particles were in-situ formed in the solder seam, the diameter of which was decreased with increasing soldering time. Smooth transition of the lattice from Al substrate to Sn-based solder was achieved by the formation of an amorphous Al2O3 interlayer at the interface. The microstructure evolution mechanism and the amorphous Al2O3 interlayer formation mechanism are discussed in detail. The shear strength of Al/Ni-Sn/Al joints increased with prolonging soldering time. The Al/Ni-Sn/Al joint ultrasonically soldered for 60 s exhibits a shear strength of 71.4 MPa, which was approximately 37 % higher than that soldered with pure Sn solder.

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“…Ultrasonic brazing is an elegant method to join Al-MMCs in air with the physical assistance. Due to the cavitation effect caused by the ultrasonic wave, not only the surface oxides are disrupted but also the wettability is enhanced [3][4][5][6][7][8][9]. However, higher ultrasonic wave energy may aggravate dissolution of the base metal, which leads to degradation of the substrate properties [10].…”

Section: Introductionmentioning

confidence: 99%

Behaviors of Oxide Film during Semisolid Brazing of SiC_p/6063Al Composite Materials

Xiao

Bai

et al. 2018

Advances in Materials Science and Engineering

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The semisolid brazing of SiCp/6063Al under an applied pressure using Zn-Al-Cu filler metal was investigated. The samples to be joined were heated from 380°C to 382°C, 386°C, 392°C, and 410°C under a constant pressure of 10 MPa, respectively. Effects of the temperature on microstructural evolution and deformation behavior of the filler metal, interfacial structure, and shear strength of the bonded joint were discussed, and the disruption behavior of the surface oxide film was studied. The results show that, after heating, the solid grains of the filler metal transform into a globular structure surrounded by liquid. The degree of sphericity and the liquid fraction tend to improve with increasing temperature. During the heating process, the deformation of the filler metal is first accomplished by plastic deformation of solid grains and then by intergrain sliding and liquid flow. The surface oxides are broken and stripped by a cocontribution of compressive and shear stress which is caused by depressing and sliding of solid grains along the composites. It is found that the heating of 380°C to 392°C under pressure is the optimum condition to disrupt the surface oxide films and obtain sound bonds. The mechanical test results show that the maximum shear strength of the bond joints is as high as 105 MPa, reaching 78% that of the parent materials.

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Ultrarapid formation of multi-phase reinforced joints of hypereutectic Al-Si alloys via an ultrasound-induced liquid phase method using Sn-51In interlayer

Cited by 16 publications

References 35 publications

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

Behaviors of Oxide Film during Semisolid Brazing of SiC_p/6063Al Composite Materials

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Ultrarapid formation of multi-phase reinforced joints of hypereutectic Al-Si alloys via an ultrasound-induced liquid phase method using Sn-51In interlayer

Cited by 16 publications

References 35 publications

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

Behaviors of Oxide Film during Semisolid Brazing of SiCp/6063Al Composite Materials

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Behaviors of Oxide Film during Semisolid Brazing of SiC_p/6063Al Composite Materials