2021
DOI: 10.1364/prj.439741
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Ultrasmall and ultradense InGaN-based RGB monochromatic micro-light-emitting diode arrays by pixilation of conductive p-GaN

Abstract: We describe 5 μm squircle InGaN-based red, green, and blue (RGB) monochromatic micro-light-emitting diodes (μLEDs) with an interpitch of 4 μm by pixilation of conductive p-GaN using a H 2 -plasma treatment. The p-GaN was passivated by H 2 plasma and prevented the current's injection into the InGaN quantum wells below. We observed that InGaN-based red μLEDs exhibited a broader full width at half-maximum and larger peak wavelength blueshift at 11.5-115 A∕cm 2 than the green/blue μLEDs. The on-wafer light output … Show more

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Cited by 26 publications
(17 citation statements)
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“…4(b). 16,18,20,21,23,26,33,[37][38][39][40][41] We also calculated the EQEs and WPEs of the LEDs at various injection currents, as shown in Fig. 5.…”
Section: (B) the Fwhm Emission Of The Leds Is Comparable To State-of-...mentioning
confidence: 99%
“…4(b). 16,18,20,21,23,26,33,[37][38][39][40][41] We also calculated the EQEs and WPEs of the LEDs at various injection currents, as shown in Fig. 5.…”
Section: (B) the Fwhm Emission Of The Leds Is Comparable To State-of-...mentioning
confidence: 99%
“…The surface recombination velocity of AlGaInP is greater than that of GaN [75]. AlGaInP red (peak wavelength (λp)≈ 632 nm) micro-LEDs with a size of 20 × 20 µm 2 exhibit a LOP density of 175 mW cm −2 [2]; the LOP density of InGaN-based red micro-LEDs has increased from 40 to 176 to 936 mW cm −2 in recent years [76][77][78]. After just one year, the LOP density of InGaN red micro-LEDs was five-fold that of AlGaInP red micro-LEDs.…”
Section: Statusmentioning
confidence: 99%
“…[44,45] Moreover, GaN-based LED has the characteristics of environmental protection, low power consumption, long life, and low operating voltage, so it is widely used in the research of light-emitting and display devices. [46][47][48][49] The production process is generally an epitaxial InGaN/GaN wafer grown on a substrate by metal organic chemical vapor deposition (MOCVD), combined with inductively coupled plasma dry etching and other technologies to carry out the chip manufacturing process. At present, although GaN-based chips have problems such as device yield, wavelength uniformity, substrate selection, etc.…”
Section: The Challenges Of Micro-ledmentioning
confidence: 99%