Ultrasonic vibration used for improving interfacial adhesion strength between metal substrate and high-aspect-ratio thick SU-8 photoresist mould

Du, Liqun; Zhai, Ke; Li, Xiaojun; Liu, Shuangjie; Tao, Yousheng

doi:10.1016/j.ultras.2020.106100

Cited by 6 publications

(4 citation statements)

References 17 publications

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“…The difficulty to adjust laser technology from benchside to operating room is likely the largest hurdle to see its medical application, considering the high cost of a laser compared to other technologies such as drills or ultrasonication [34,35]. However, this technology is employed with an unprecedent resolution.…”

Section: Discussionmentioning

confidence: 99%

Bone Laser Patterning to Decipher Cells Organization

Touya¹,

Al‐Bourgol²,

Desigaux³

et al. 2022

Preprint

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Laser patterning of implant materials for bone tissue engineering purposes has shown to be a promising technique to control cell properties such as adhesion or differentiation, resulting in an enhanced osteointegration. However, the perspective of patterning the bone tissue side interface to generate microstructure effects has never been investigated. In the present study, three different laser-generated patterns were machined on the bone surface with the aim to identify the best surface morphology compatible with osteogenic-related cells recolonization. The laser patterned bone tissue was characterized by electron scanning microscopy and confocal microscopy in order to obtain a comprehensive picture of the bone surface morphology. Cortical bone patterning impact upon cell compatibility and cytoskeleton rearrangement to the patterned surfaces was performed with Stromal Cells from Apical Papilla (SCAPs). Results indicated that laser machining had no detrimental effect upon consecutively seeded cells metabolism. Orientation assays revealed that surface patterning characterized by larger hatch distances was correlated with a higher cell cytoskeletal conformation to the laser-machined patterns. For the first time, to our knowledge, bone is considered and assessed here as a potentially engineered-improvable biological interface. Further studies shall focus on in vivo implications of this direct patterning.

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Section: Discussionmentioning

confidence: 99%

Bone Laser Patterning to Decipher Cells Organization

Touya¹,

Al‐Bourgol²,

Desigaux³

et al. 2022

Preprint

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“…16b showing the SEM image of electroformed micro inertial switch device. 71 Similarly, Zhao et al conducted a study on the impact of ultrasonic agitation on the adhesion strength of micro electroforming in MEMS devices. To investigate the influence of ultrasonic agitation on adhesion strength, they carried out experiments at various ultrasonic powers (0 W, 100 W, 150 W, 200 W, and 250 W) and frequencies (0 kHz, 40 kHz, 80 kHz, 120 kHz, 200 kHz).…”

Section: Advancement In Micro-electroformingmentioning

confidence: 99%

“…Figure 16. (a) Vertical view of SU-8 molds (b) SEM images of electroformed micro inertial switch device, reproduced with permission 71. …”

mentioning

confidence: 99%

Review—Electroforming Process for Microsystems Fabrication

Rai,

Gupta

2023

J. Electrochem. Soc.

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Being an unconventional technique of additive micro-manufacturing, electroforming has garnered significant interest by various industrial sectors because of its capability to offer advanced micro-manufacturing competences with high precision in achieving dimensional uniformity and replication accuracy at small scale. This paper reports a comprehensive review of the electroforming process as a microsystem fabrication technique. This process is superior compared to 3D printing, stereolithography, selective laser sintering, and fused deposition modeling etc., in many aspects due to its unique properties. It can deposit a wide variety of metals and alloys, including precious metals, making it appropriate for variegated applications in microfabrication domain. We cover the fundamental aspects of electroforming and its history followed by the current state of the art advancement, modelling associated with it, and its importance from industrial context. Additionally, we discuss the advantages and limitations of this technique and their respective microsystems applications. Finally, we conclude with a discussion on the future prospects and potential advancements in the field of electroforming contributing to micro-systems development.

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“…The SU-8 manufacturer provides a "recipe" for the appropriate procedure to form SU-8 films with thicknesses within approximately one hundred and a couple of tens of micrometers. Du et al [17] studied the adhesion strength between the substrate and "thick" SU-8 film with a thickness of 120 μm. Mao et al [18] proposed a method for releasing SU-8 structure from the substrate; the maximum thickness of the structures they experimented with was 150 μm.…”

Section: Introductionmentioning

confidence: 99%

Methodology for the formation of photoresist films with uniform thicknesses of several hundred micrometers

et al. 2020

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To enhance the capabilities of photolithography in the field of microfluidic technology, this study establishes a method to produce a photoresist film with a uniform thickness spanning several hundred micrometers. Herein, the target thickness of the trial production films is 400 μm. The SU-8 3000 series and 4-inch silicon wafers were adopted as the photoresist and substrates, respectively. It was found that when a large amount of SU-8 is formed using the normal procedure, and the film thickness is biased in a certain direction and becomes non-uniform. The reason for this film thickness bias has not been clarified, but it is confirmed that the bias is induced during the soft baking of the resist and not during the coating process. Accordingly, this study proposes a new method to remediate and equalize the biased films. Before film remediation, the photoresist should be adequately soft-baked. However, it is difficult to do this inside of the thick film by simple heating. Thus, some techniques used to facilitate baking thick resist layers are also introduced. Trial production films that are appropriately remediated are obtained. It is shown that in the center region of a remedied film with a 40-mm diameter, the deviation of the local thickness is within 1%, i.e., the thickness bias is completely eliminated. The thickness can also be controlled by remediation with a reproducibility of 1%. The results indicate that the proposed method used to form thick photoresist films is effective for practical applications.

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Ultrasonic vibration used for improving interfacial adhesion strength between metal substrate and high-aspect-ratio thick SU-8 photoresist mould

Cited by 6 publications

References 17 publications

Bone Laser Patterning to Decipher Cells Organization

Bone Laser Patterning to Decipher Cells Organization

Review—Electroforming Process for Microsystems Fabrication

Methodology for the formation of photoresist films with uniform thicknesses of several hundred micrometers

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