Abstract:This paper proposes the use of ultrasonic bulgeforming process to fabricate T2 copper foil micro-structures. This approach involves the ultrasonic plasticization of powder in a laminated die cavity and the subsequent formation of a molten resin bulge. The laminated die is fabricated by microdouble-staged laminated object manufacturing and is then used as a concave micro-cavity. This technique uses ultrasonic melt polymer powder as a soft punch. Then, T2 copper foils are extruded into the concave die cavity. Co… Show more
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