Ultrasound-induced break-in method for an incoming polyvinyl acetal (PVA) brush used during post-CMP cleaning process

Lee, Jung-Hwan; Poddar, Maneesh Kumar; Yerriboina, Nagendra Prasad; Ryu, Hoon; Han, Kwang-Min; Kim, Tae-Gon; Hamada, Shigeru; Wada, Yutaka; Hiyama, Hirokuni; Park, Jin-Goo

doi:10.1016/j.polymertesting.2019.105962

Cited by 11 publications

(12 citation statements)

References 19 publications

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“…In the previous studies, scanning electron microscopy (SEM) has been commonly used for imaging nanoparticles adsorbed on a PVA surface. 11, 19,20,33 In addition, fluorescence microscopy has been employed for real-time observations of dynamic nanoparticle movements during the PVA brush scrubbing. 33,34 However, these methods do not allow us to directly measure the interaction forces acting between the nanoparticles and the PVA surfaces.…”

Section: Introductionmentioning

confidence: 99%

“…Recently, such interactions between nanoparticles and PVA have attracted special attention due to growing demands for reducing cross-contamination between wafers. ,− During post-CMP cleaning, some nanoparticles removed from a wafer are adsorbed on the PVA brush and redeposited on the wafer, leading to a low removal efficiency and/or cross-contamination between different wafers. In addition, these nanoparticles can cause serious damage to the wafer and PVA brush during cleaning.…”

Section: Introductionmentioning

confidence: 99%

“…In addition, these nanoparticles can cause serious damage to the wafer and PVA brush during cleaning. To solve these issues, optimal process parameters and brush cleaning methods have been investigated. ,− However, a detailed understanding of a nanoparticle–PVA interaction has remained elusive. In particular, the influence of hydration on nanoparticle adhesion to a PVA brush has hardly been investigated.…”

Section: Introductionmentioning

confidence: 99%

“…One reason for the absence of such studies lies in the difficulties inherent in the direct measurement of interactions between a nanoparticle and a corrugated PVA brush surface in a liquid environment. In the previous studies, scanning electron microscopy (SEM) has been commonly used for imaging nanoparticles adsorbed on a PVA surface. ,,, In addition, fluorescence microscopy has been employed for real-time observations of dynamic nanoparticle movements during the PVA brush scrubbing. , However, these methods do not allow us to directly measure the interaction forces acting between the nanoparticles and the PVA surfaces. Furthermore, PVA is known as a water-soluble polymer and, hence, the interface could present complicated three-dimensional (3D) mixtures of flexible polymer chains, water, and ammonia.…”

Section: Introductionmentioning

confidence: 99%

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Inhibition of Silica Nanoparticle Adhesion to Poly(vinyl alcohol) Surfaces by Ammonia-Mediated Hydration: Implications for Effective Post-Chemical–Mechanical Planarization Cleaning

Ikarashi

Yoshino

Nakajima

et al. 2020

ACS Appl. Nano Mater.

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Adhesion of silica abrasive nanoparticles to a poly(vinyl alcohol) (PVA) brush surface in a post-CMP (chemical mechanical planarization) cleaning leads to serious 1 problems in yield enhancement of semiconductor fabrication. However, the nanoscale adhesion mechanism and its correlation with process conditions have hardly been understood. In this study, we investigated the influence of ammonia in the cleaning solution on silica nanoparticle adhesion to a PVA surface. By atomic force microscopy (AFM), we directly measured adhesion forces between a nanoscale silica probe and a PVA brush surface in various solutions and found that ammonia has a significant inhibitory effect against silica nanoparticle adhesion to a PVA surface. Importantly, we found that this effect cannot be explained by the electrostatic interactions alone, but also involves steric repulsion between silica and hydrated PVA. We also performed molecular-scale three-dimensional scanning force microscopy (3D-SFM) imaging and contact angle measurements, and found that ammonia promotes hydration and swelling of PVA. Furthermore, we performed molecular dynamics simulations and found that ammonia promotes dynamic rearrangements of hydrogen bonding networks (HBNs) at a PVA-water interface, giving extra flexibility to the PVA chains. Such flexibility promotes local swelling of PVA and inhibits silica nanoparticle adhesion to a PVA surface. This provides important guidelines for optimizing nanoscale structures and interactions of brush surfaces and abrasive nanoparticles in post-CMP cleaning.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Inhibition of Silica Nanoparticle Adhesion to Poly(vinyl alcohol) Surfaces by Ammonia-Mediated Hydration: Implications for Effective Post-Chemical–Mechanical Planarization Cleaning

Ikarashi

Yoshino

Nakajima

et al. 2020

ACS Appl. Nano Mater.

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“…6 Generally, diluted hydrofluoric acid, SC-1, and ammonium hydroxide are widely used as cleaning solutions in post-CMP cleaning. 7,8 In the CMP process, silica and ceria are mainly used as abrasive particles. In particular, the removal rate of ceria is high because it forms Ce-O-Si bonds and peels off the oxide film surface.…”

mentioning

confidence: 99%

Effect of Viscosity on Ceria Abrasive Removal during the Buff Clean Process

Kim

Hong

Kim

et al. 2020

ECS J. Solid State Sci. Technol.

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In this study, the effect of viscosity on ceria abrasive removal during the buff clean process was investigated. First, a numerical simulation was performed to observe the shear stress on the wafer. The shear stress increased as the viscosity increased. These results imply that the viscosity increases the drag force acting on the abrasives, which can improve abrasive removal. Based on the results of the numerical simulation, the ceria abrasive removal was measured using inductively coupled plasma mass spectroscopy (ICP-MS). The ICP-MS results showed that the increased viscosity improved the cleaning efficiency of the ceria abrasive removal by 70%. In addition, a lowering of the water temperature also resulted in an increase in abrasive removal as the viscosity increased. These results can be used to improve ceria abrasive removal during the buff clean process.

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Operational Parameters in Dye Decolorization via Sonochemical and Sonoenzymatic Treatment Processes

Poddar,

Prabhakar,

Mahalingam

2022

Sustainable Textiles: Production, Processing, Manufacturing &Amp; Chemistry

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Ultrasound-induced break-in method for an incoming polyvinyl acetal (PVA) brush used during post-CMP cleaning process

Cited by 11 publications

References 19 publications

Inhibition of Silica Nanoparticle Adhesion to Poly(vinyl alcohol) Surfaces by Ammonia-Mediated Hydration: Implications for Effective Post-Chemical–Mechanical Planarization Cleaning

Inhibition of Silica Nanoparticle Adhesion to Poly(vinyl alcohol) Surfaces by Ammonia-Mediated Hydration: Implications for Effective Post-Chemical–Mechanical Planarization Cleaning

Effect of Viscosity on Ceria Abrasive Removal during the Buff Clean Process

Operational Parameters in Dye Decolorization via Sonochemical and Sonoenzymatic Treatment Processes

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