Ultrathin DPN STI SiON liner for 40nm low-power CMOS technology

Hu, Chih-Lin; Chen, Jone F.; Chen, Shih‐Chih; Chang, Shoou Jinn; Lee, Kay Ming; Lee, Chih Ping

doi:10.1016/j.sse.2010.01.019

Cited by 1 publication

(2 citation statements)

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“…Several published reports about the role of oxygen vacancies support this proposition. Deshpande et al 78 and Dutta et al 7,9 among others, have shown that ceria nanoparticles have Ce 3+ on the surface and that oxygen vacancies drive the formation of Ce 3+ from Ce 4+ . Based on DFT calculations, Preda et al 80 proposed that, on the surface of a ceria particle, a Ce 3+ site with an oxygen vacancy can interact with molecular oxygen and can possibly form two species, a Ce 4+ superoxo species or a Ce 3+ peroxo species (Figure 8).…”

Section: Characteristics Of Ceria Abrasivesmentioning

confidence: 99%

“…STI is a method of electrically isolating active areas using trenches created in the Si substrate around the active elements and filling it with an insulating dielectric, such as silicon dioxide or silicon oxy-nitride or silicon carbonitride. [7][8][9][10][11] Process details of the STI structures are available in numerous publications. There are a multitude of techniques available for oxide deposition and even though the resulting oxides have very different properties, for simplicity we do not distinguish between them in this review.…”

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confidence: 99%

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Shallow Trench Isolation Chemical Mechanical Planarization: A Review

Ramanathan

Dandu

Babu

2015

ECS J. Solid State Sci. Technol.

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Electrical isolation of the billion or so active components in each integrated device is achieved using shallow trench isolation (STI) which requires chemical mechanical planarization (CMP) involving silicon dioxide removal at a high rate and stopping on an underlying silicon nitride film. Several colloidal slurries with various additives can yield the desired high rate selectivity between the oxide and nitride films during CMP while maintaining an acceptably low nitride rate. Here, many of such high selectivity STI CMP slurries described in the literature are reviewed along with the characteristics of the colloidal dispersions like the abrasives, additives, the interactions between them and with the films being planarized and the associated pH range in which the high selectivity is observed. The mechanisms proposed to explain the high reactivity of ceria with oxide, the role of additives in suppressing the nitride removal rate and resulting high selectivity are discussed. Reduction of a multitude of defects in post-CMP processed STI structures still remains an important challenge, especially as the feature sizes continue to shrink. Chemical mechanical planarization (CMP) is one of the important enabling processes in facilitating multilevel metallization (in some cases reaching up to 14 levels) and incorporation of novel gate and channel materials at the component level in modern semiconductor device manufacturing where its use has become widespread and ubiquitous.1-6 Here, we review recent advances and remaining challenges in one specific application of CMP, the shallow trench isolation (STI) process. STI is a method of electrically isolating active areas using trenches created in the Si substrate around the active elements and filling it with an insulating dielectric, such as silicon dioxide or silicon oxy-nitride or silicon carbonitride.7-11 Process details of the STI structures are available in numerous publications. There are a multitude of techniques available for oxide deposition and even though the resulting oxides have very different properties, for simplicity we do not distinguish between them in this review. For completeness and ease of reference, a schematic representation of the STI process is given in Figure 1. While the trenches are being filled, silicon dioxide also deposits over unwanted areas on the entire wafer (since selective deposition in trenches only is not possible) creating an uneven topography. The excess and unwanted oxide has to be completely removed and CMP has proven to be the only viable and robust global and local planarization capable process technology.Here, as shown in Figure 1, presence of a very thin silicon nitride stop layer (deposited on another thin pad oxide layer to control film stress) is an essential and integral part of the process. This nitride stop layer prevents any damage during planarization to the all-important epitaxially grown surface underneath and is itself removed by a wet etch process subsequent to the overburden oxide removal. Since the integrity of the...

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Section: Characteristics Of Ceria Abrasivesmentioning

confidence: 99%

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confidence: 99%