2017
DOI: 10.1016/j.apsusc.2016.06.001
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Ultrathin SiO 2 layer formed by the nitric acid oxidation of Si (NAOS) method to improve the thermal-SiO 2 /Si interface for crystalline Si solar cells

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Cited by 27 publications
(10 citation statements)
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“…After the construction of Al electrode, Si substrates were transferred to a home-made chamber with controlled humidity of 60% for 2 hr in order to grow an extremely thin layer of Si oxide (1~3 nm) on the surfaces of texturized structures. In addition, a recent literature reported that a very thin layer of Si oxide could also effectively passivate Si surfaces 13 . Next, a PEDOT:PSS dispersion (Clevios PH1000) was spun-coated onto the texturized surfaces at constant speed of 3000 rpm for 1 min and then heated at 120 °C for 15 min under the ambient atmosphere.…”
Section: Methodsmentioning
confidence: 99%
“…After the construction of Al electrode, Si substrates were transferred to a home-made chamber with controlled humidity of 60% for 2 hr in order to grow an extremely thin layer of Si oxide (1~3 nm) on the surfaces of texturized structures. In addition, a recent literature reported that a very thin layer of Si oxide could also effectively passivate Si surfaces 13 . Next, a PEDOT:PSS dispersion (Clevios PH1000) was spun-coated onto the texturized surfaces at constant speed of 3000 rpm for 1 min and then heated at 120 °C for 15 min under the ambient atmosphere.…”
Section: Methodsmentioning
confidence: 99%
“…[32] In contrast, to obtain high passivation quality by SiO x , the film thickness must be increased by hightemperature annealing, followed by forming gas annealing (FGA) to terminate active defects. [33,34] Therefore, the optimization is hardly realized due to the tradeoff between carrier tunneling probability and passivation quality.…”
Section: Introductionmentioning
confidence: 99%
“…However, these SiO x films themselves have inferior passivation quality and need further thickening from %1 up to %5 nm, high-temperature annealing at %1100 °C, and FGA to improve passivation quality. [33,34] As chemical oxide passivation layers, the lowest surface recombination velocity of 42 cm s À1 at an excess carrier density (Δn) of 10 15 cm À3 has been reported, in which SiO x was formed using HNO 3 oxidation and following high-temperature thermal treatment. [33] However, ultrathin SiO x layers with both good passivation quality and carrier tunneling properties have not yet been reported.…”
Section: Introductionmentioning
confidence: 99%
“…As an alternative, organic materials with a methyl/allyl group acted as a passivation layer, while the V OC reached only 568 mV. Besides, inorganic materials such as SiO x , were used as the passivation layer, yet they needed strong acid or high-temperature (>450 °C) treatment. He et al.…”
Section: Introductionmentioning
confidence: 99%