Underfill Selection Strategy for Pb-Free, Low-K and Fine Pitch Organic Flip Chip Applications

Paquet, M.-C.; Gaynes, Michael; Duchesne, Éric; Questad, D.; Belanger, L.; Sylvestre, M.

doi:10.1109/ectc.2006.1645870

Cited by 33 publications

(14 citation statements)

References 7 publications

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“…A second adhesion test that has been developed by IBM [2], was conducted to compare the new VCUF formulation to a qualified CUF for which reliability is known to be good.…”

Section: Adhesion Strength Of Vucf Materialsmentioning

confidence: 99%

“…Vacuum underfill (VCUF) technology is emerging as a potential candidate to provide more favorable processing through-put and yields as well as the possibility of achieving new target properties that were not attainable with traditional capillary underfills. [1] Capillary underfill [2] is the current standard technology and has had a long and successful history for enabling reliable flip chip packaging. These materials have been improved gradually and the cured mechanical properties have been adjusted to be less rigid and more compliant, balancing the requirements to maintain solder joint reliability and preserve the integrity of fragile chip structures.…”

Section: Introductionmentioning

confidence: 99%

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Vacuum underfill technology for advanced packaging

Horibe

Paquet

Gaynes

et al. 2011

2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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We developed vacuum assisted underfill technology for large die (>18 × 18 mm) with fine pitch area array bumps (< 150 m pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for such an advanced package. It was also confirmed that the newly developed underfill materials have good reliability on the large die package.

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“…A second adhesion test that has been developed by IBM [2], was conducted to compare the new VCUF formulation to a qualified CUF for which reliability is known to be good.…”

Section: Adhesion Strength Of Vucf Materialsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Vacuum underfill technology for advanced packaging

Horibe

Paquet

Gaynes

et al. 2011

2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

Self Cite

View full text Add to dashboard Cite

show abstract

“…Such failures are also caused by the stress and strain generated within the LSI package, due to thermal cycling under both environmental and operation temperatures. Moreover, underfill dispensing will become increasingly more complicated with the use of the narrower, shorter gaps required for future interconnections [2]. Since direct Cu interconnections without solder joints do not affect the concentration of thermal stress, their use is expected to enable the fabrication of finer pitch interconnections.…”

Section: Introductionmentioning

confidence: 99%

Reliability of thin seamless package with embedded high-pin-count LSI chip

Kikuchi

Ohshima

Nakashima

et al. 2010

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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We have previously reported the technology for embedding a 1500-pin microprocessor chip in a thin LSI package using a rigid Cu plate. The reliabilities of this seamless package with the direct interconnection between the LSI chip and substrate wiring have now been evaluated at the package and board levels. The package passed all the LSI function tests at the package level even after 2000 thermal cycles. The microstructure of the interconnect, evaluated using electron backscatter diffraction and transmission electron microscopy, showed a high interconnect reliability. The reliability at the board level was evaluated using the thermal cycles testing, the shadow-moiré method and strain gauge measurement with the package mounted on a system board. Thanks to the Cu plate, the warpage and strain characteristics are excellent, resulting in uniform stress distribution. Therefore, this seamless packaging technology is promising for the fabrication of thin, highly reliable LSI packages for replacing flip chip ball grid array packages.

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“…[1] Crack prevention properties are generally in opposition of traditional target properties that provide robust bump fatigue life. [2] Underfill materials present the significantly challenging task of maintaining bump protection while ensuring ultra low-K (ULK/ELK) integrity for flip chip plastic ball grid array (FCPBGA) packaging. Technology nodes with increasingly smaller integration scales generally introduce more brittle materials and stricter design constraints, therefore significantly increasing the complexity of reliable underfill.…”

Section: Introductionmentioning

confidence: 99%