Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

“…The aforementioned literature mentions that the radial cohesive crack might form in the glass during heating, and the Cu metallization thickness dependence stress generated in glass substrate is estimated. The maximum stress of the glass interposer under 130 °C temperature loading presented in the current study is comparable to the results revealed in Okoro’s work [ 13 ]. However, the other TGV-related structural layout designs, including TGV via diameter and TGV pitch, are not discussed in the literature.…”

“…Stress introduced during cooling might cause the circumferential-type cracking in TGV architecture [ 13 , 14 ]. For this reason, the stress contour of the glass interposer structure is also extracted to investigate the stress distribution and magnitude generated by the cooling procedure.…”

“…In addition, the failure mechanism and optimization rule of TGV interposer architecture were systemically investigated [ 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ]. Tensile radial and circumferential stresses were attributed to the origin of the circumferential cracks and the formation of radial cracks, respectively [ 11 , 13 , 14 ].…”

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

“…For this reason, the suddenly enlarged first principal stress of the glass was considered to be generated by the 130 °C curing temperature loading. Comparing the stress results of present study and Okoro’s data [ 12 ], it is evident that the thermocompression process-induced stress can reach up to 121 MPa under 130 °C curing temperature. In Okoro’s work, the TGV annealing procedure-induced stress on the glass interposer was 400 MPa under general 420 °C annealing temperature, and foregoing stress further enhanced the stress to 640 MPa with 650 °C annealing.…”

“…The time- and temperature-dependent protrusion behavior of copper (Cu)-filled glass via (TGV) under different annealing temperatures and dwell times has been analyzed [ 11 ]. A specific failure of radial and circumferential cracks has been separately observed and attributed to the stress buildup during the heating and cooling process in the annealing heat treatment procedure [ 12 , 13 ]. The critical stress location of Cu-filled TGV has been explored as a Cu/glass interface because the mismatching of the aforementioned material CTE, the slower ramp rate, and the decent dwell time can help manage the thermal stress [ 14 , 15 ].…”