“…3,4) On the other hand, there is a growing demand to scale down the MEMS components towards the dimensions of sub-micrometers and nanometers, 9,10) in which the contact force could be drastically reduced to the range from less than 1 µN to around 50 µN. In such a low force region, electrical contact instability has been constantly observed in micro-contact tests, [11][12][13] and it is believed that the surface contamination plays an important role in determining the contact behavior for DC MEMS switches. 14,15) "Burn-in" process 16) under a contact voltage of 2-3 V or the "Schaltreinigung" procedure 17) (pre-switching with 50 V dc, 50 mA in nitrogen) was often applied to mitigate the effects of the surface contamination film and obtain appropriate resistance values; however, those methods can be destructive to miniature MEMS switches due to the high voltage/current level.…”