2013
DOI: 10.1016/j.jallcom.2013.04.113
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Understanding of the correlation between work function and surface morphology of metals and alloys

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Cited by 39 publications
(12 citation statements)
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“…Liu et al [20] performed a numerical study of different orientations/alignments and arrays (vertical, tilt, rainbow shaped and spiral) of CNT and showed that the electric field for a particular orientation is maximum at its tip; the one with the maximum aspect ratio produced the highest field. The current experimental results are in agreement with the findings of [19,20] as seen in the higher current for the etchedeetched (R z ¼ 2.28 mm) configuration compared to the smoothesmooth (R z ¼ 0.58 mm) configuration. The sharpness (e.g.…”
Section: Resultssupporting
confidence: 90%
See 1 more Smart Citation
“…Liu et al [20] performed a numerical study of different orientations/alignments and arrays (vertical, tilt, rainbow shaped and spiral) of CNT and showed that the electric field for a particular orientation is maximum at its tip; the one with the maximum aspect ratio produced the highest field. The current experimental results are in agreement with the findings of [19,20] as seen in the higher current for the etchedeetched (R z ¼ 2.28 mm) configuration compared to the smoothesmooth (R z ¼ 0.58 mm) configuration. The sharpness (e.g.…”
Section: Resultssupporting
confidence: 90%
“…7). Xue et al [19] experimentally found that sharp micro/nano features at a rough surface resulted in a lower work function. At the tip of a micro/nano structure, an atom has lesser coordination atoms surrounding it than those at a flat surface which causes the maximum electric field to occur at the tip of a sharp feature.…”
Section: Resultsmentioning
confidence: 99%
“…In particular, the weak interaction between valence electrons and nuclei on rough surfaces facilitates the escape of electrons from the surface, resulting in a low WF. 4 The introduction of small molecules or a non-conjugated polyelectrolyte interface layer can also change the electrical field distribution between the semiconductor and the electrode. This electric field redistribution leads to Fermi level pinning, electric double-layer formation, charge transfer, spontaneous dipole orientation, spontaneous interfacial dipole orientation, 5 electron pushback (repulsion), and interface dipole formation.…”
Section: Introductionmentioning
confidence: 99%
“…In particular, the weak interaction between valence electrons and nuclei on rough surfaces facilitates the escape of electrons from the surface, resulting in a low WF. 4…”
Section: Introductionmentioning
confidence: 99%
“…That is, the potential fluctuations measured by SKP are essentially averaged over dozens of grains. Second, the EWF is sensitive to surface geometrical configurations [10], such as the surface roughness [11] and microcracks [12], which can be regarded as an interference factor in SKP measurement.…”
Section: Introductionmentioning
confidence: 99%