“…In comparison with traditional lead-tin containing soldering technology, ACF joints have gained popularity for their various advantages: lower processing temperatures, environmental compatibility, flux-less bonding, high density interconnections, simpler processing and low fabrication cost (Nishida et al, 1998;Liu, 1999;Lau et al, 2002). During the past decade, numerous studies have been carried out on the mechanical and electrical properties of ACFs (Lin and Chen, 2005;Lin et al, 2006;Gao et al, 2009Gao et al, , 2010Gao et al, , 2012aGao et al, , 2012bMubashar et al, 2009), and the influence of bonding parameters on the stability and reliability performance of anisotropic conductive interconnections (Chan and Luk, 2002;Kim et al, 2004Kim et al, , 2008Chen et al, 2006aChen et al, , 2006bYim and Paik, 2006;Yim et al, 2007;Noh et al, 2009;Lin et al, 2011aLin et al, , 2011bLin et al, , 2011c. These studies are believed to have promoted the development of ACF joints using fine pitch flip chip on substrate with better reliability and performance.…”