Uniform Surface Oxidation of an Si Substrate by a Planar Modulated Inductively Coupled Thermal Plasma with Molecular Gas Feed

Tial, Mai Kai Suan; Tanaka, Yasunori; Maruyama, Yuji; Uesugi, Yoshihiko; Ishijima, Tatsuo

doi:10.1007/s11090-017-9803-0

Cited by 5 publications

(3 citation statements)

References 27 publications

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“…Conventional cylindrical torches are only suitable to a slight degree for large-area material processing because thermal plasma in the cylindrical quartz tube shrinks as a result of the Lorentz force. For this reason, planartype ICTP torches have been developed for large-area materials processing [77]- [79].…”

Section: Planar Type Induction Thermal Plasmamentioning

confidence: 99%

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Recent development of new inductively coupled thermal plasmas for materials processing

Tanaka

2021

Advances in Physics: X

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This paper explains recent developments in the field of inductively coupled thermal plasmas (ICTP or ITP) used for materials processing. Inductive coupling technique is important to produce thermal plasma with high gas temperature at high pressures. Conventional cylindrical ICTP was developed originally in the 1960s by T. Reed. It remains widely used for different materials processing today, with almost identical configuration to the original version. Through some revision and improved functionalization, ICTPs of several kinds such as DC-RF hybrid ICTP have also been developed. They are also widely adopted for processing of various materials because of their various benefits. Inductively coupled plasma at low pressures are not treated herein: only thermal plasma with high enthalpy. One is modulated induction thermal plasma (MITP), which has a function of controlling the temperature and chemical active fields in the time domain. Another development in ICTP includes changes in the ICTP configuration such as a planar-ICTP and loop-ICTP. These were developed for large-area materials processing.

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Section: Planar Type Induction Thermal Plasmamentioning

confidence: 99%

“…The MITP+TCFF method is useful to synthesize nanoparticles at a high production rate. Finally, topics will be described for large-area materials processing by thermal plasma [77][78][79][80][81]. For this purpose, some improvements and developments have been made to ICTP torches.…”

Section: Introductionmentioning

confidence: 99%

Recent development of new inductively coupled thermal plasmas for materials processing

Tanaka

2021

Advances in Physics: X

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“…It also has a feature of high densities of chemically active species not only because of electron impact reaction but also because of heavy particle-heavy particle collision reactions. For the reasons described above, the thermal plasma is used widely for materials processing, such as nanoparticle synthesis [1][2][3][4][5][6], surface modification [7][8][9][10] and thin film deposition [11][12][13]. Among thermal plasmas, an inductively coupled thermal plasmas or induction thermal plasma (ITP) is used frequently for nanomaterial synthesis because of less contamination due to electrode-less discharge.…”

Section: Introductionmentioning

confidence: 99%

Numerical thermofluid simulation on tandem type of induction thermal plasmas with and without current modulation in a lower coil

Onda¹,

Tanaka²,

Akashi³

et al. 2020

J. Phys. D: Appl. Phys.

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This paper describes numerical calculations on tandem-type induction thermal plasmas with and without current modulation of the lower coil. The tandem type of induction thermal plasma (tandem-ITP) has been developed with two independent rf coils in one plasma torch for stable operation and spatial control of temperature field in ITP. Furthermore, the coil current modulation for tandem-ITP, i.e. tandem type of pulse-modulated induction thermal plasma (tandem-PMITP), is expected to offer a temporo-spatially varying temperature field in the plasma torch. First, as described in this paper, a numerical thermofluid model was developed for tandem-ITP/PMITP with an upper coil and a lower coil to investigate unique temperature and gas flow fields. Secondly, the influence of gap length between the upper coil and the lower coil was studied in the tandem-ITP under steady state conditions. Results show that a shorter gap length between two coils of the tandem-ITP is favourable for materials processing because it suppresses unfavourable radial gas flow to the wall in the plasma torch. Thirdly, transient calculation was conducted for the tandem-PMITP with current modulation in the lower coil to investigate effects of an off-time modulation parameter on the temperature field. Results showed that coil current modulation provides unique temporo-spatially varying temperature and gas flow fields. Finally, calculation results for a tandem-PMITP were compared with those for a single-coil PMITP. Comparison revealed that tandem-PMITP has higher robustness in modulated induction thermal plasma by maintaining a higher-temperature region than that of the single-coil MITP. The tandem-PMITP can provide more controlled temperature and gas flow fields.

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Loop Type of Inductively Coupled Thermal Plasmas System for Rapid Two-Dimensional Oxidation of Si Substrate Surface

Tanaka

Maruyama

Fujita

et al. 2018

Plasma Chem Plasma Process

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Uniform Surface Oxidation of an Si Substrate by a Planar Modulated Inductively Coupled Thermal Plasma with Molecular Gas Feed

Cited by 5 publications

References 27 publications

Recent development of new inductively coupled thermal plasmas for materials processing

Recent development of new inductively coupled thermal plasmas for materials processing

Numerical thermofluid simulation on tandem type of induction thermal plasmas with and without current modulation in a lower coil

Loop Type of Inductively Coupled Thermal Plasmas System for Rapid Two-Dimensional Oxidation of Si Substrate Surface

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