Universal assembly of liquid metal particles in polymers enables elastic printed circuit board

Lee, Wonbeom; Kim, Hyunjun; Kang, In-Ho; Park, Hongjun; Jung, Jiyoung; Lee, Haeseung; Park, Hyunchang; Park, Ji Su; Yuk, Jong Min; Ryu, Seunghwa; Jeong, Jae‐Woong; Kang, Jiheong

doi:10.1126/science.abo6631

Cited by 198 publications

(164 citation statements)

References 50 publications

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“…Figure 2(c) shows a scanned 3D model of the first author's head and an LMPA statue fabricated from it. As indicated in the literature, LMPA has excellent potential for future multi-functional applications, [28][29][30][31][32] including smart structures, electromagnetic shielding, biomedicine, thermal management, and energy harvesting. To the best of our knowledge, our study is the first to demonstrate the fabrication of complex lattice, tooth, and bone LMPA structures using EAM, which is a low-cost AM technique.…”

Section: D Printing Of Complex Pure Lmpa Partsmentioning

confidence: 99%

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Low-melting-point alloys integrated extrusion additive manufacturing

Jiang¹,

Zhai²,

Zhang³

et al. 2023

Preprint

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<p>Additive manufacturing has developed significantly. In contrast to established fabricated materials, low-melting-point alloys (LMPAs) are increasingly attractive because they have favorable electrical/thermal conductivities and mechanical strengths. However, LMPA additive manufacturing is still in its infancy. We report a novel strategy for fabricating the complex and/or multifunctional components of LMPAs by extrusion additive manufacturing with two nozzles (for extruding the polymer and for extruding the LMPA). The proposed strategy was used to successfully fabricate complex LMPA components for the first time. We fabricated LMPA/polymer composite parts with improved mechanical properties, and implemented the integrated manufacturing of circuits and 3D products. The strategy will enable the use of LMPAs in applications such as smart structures, electromagnetic shielding, biomedicine, thermal management, energy harvesting, and advanced electronics.</p>

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Section: D Printing Of Complex Pure Lmpa Partsmentioning

confidence: 99%

“…[27] The literature shows that LMPAs have excellent potential for future multi-functional applications. [28][29][30][31][32] However, the fabrication of good quality complex LMPA parts by 3D printing techniques remains challenging, and additive manufacturing LMPA is still in its infancy.…”

Section: Introductionmentioning

confidence: 99%

Low-melting-point alloys integrated extrusion additive manufacturing

Jiang¹,

Zhai²,

Zhang³

et al. 2023

Preprint

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“…(Tang et al, 2022a) Copyright@2022, Wiley (E) Schematic illustration of the fabrication of SEA using screen printing (Dong et al, 2021). Copyright@2021, Wiley (F) Schematic of the formation of LM nanoparticles (LMPnano) at the surface of existing micrometer-sized LM particles (LMPs) via acoustic field application (Lee et al, 2022b). Copyright@2022, AAAS (G) Electrical conductivity of the LMP-polymer composite as a function of the LM content before and after the LMPNet formation (Lee et al, 2022b).…”

Section: Figurementioning

confidence: 99%

Liquid metal enabled conformal electronics

Ping

Zhou²,

Zhang³

et al. 2023

Front. Bioeng. Biotechnol.

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The application of three-dimensional common electronics that can be directly pasted on arbitrary surfaces in the fields of human health monitoring, intelligent robots and wearable electronic devices has aroused people’s interest, especially in achieving stable adhesion of electronic devices on biological dynamic three-dimensional interfaces and high-quality signal acquisition. In recent years, liquid metal (LM) materials have been widely used in the manufacture of flexible sensors and wearable electronic devices because of their excellent tensile properties and electrical conductivity at room temperature. In addition, LM has good biocompatibility and can be used in a variety of biomedical applications. Here, the recent development of LM flexible electronic printing methods for the fabrication of three-dimensional conformal electronic devices on the surface of human tissue is discussed. These printing methods attach LM to the deformable substrate in the form of bulk or micro-nano particles, so that electronic devices can adapt to the deformation of human tissue and other three-dimensional surfaces, and maintain stable electrical properties. Representative examples of applications such as self-healing devices, degradable devices, flexible hybrid electronic devices, variable stiffness devices and multi-layer large area circuits are reviewed. The current challenges and prospects for further development are also discussed.

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“…The hybrid rigid-soft electronic system should inevitably offer a near future in which the function and stretchability are combined by the integration of solid chips onto the stretchable soft substrate . For that, lots of critical technical problems still require to be solved as follows. First, the inevitable Young’s modulus mismatch between the rigid chips and the stretchable interconnection presents a great challenge to the stretchability requirement of the flexible system .…”

Section: Introductionmentioning

confidence: 99%

Graded Mxene-Doped Liquid Metal as Adhesion Interface Aiming for Conductivity Enhancement of Hybrid Rigid-Soft Interconnection

Chen

Deng

et al. 2023

ACS Appl. Mater. Interfaces

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Hybrid rigid-soft electronic system combines the biocompatibility of stretchable electronics and the computing capacity of silicon-based chips, which has a chance to realize a comprehensive stretchable electronic system with perception, control, and algorithm in near future. However, a reliable rigid-soft interconnection interface is urgently required to ensure both the conductivity and stretchability under a large strain. To settle this demand, this paper proposes a graded Mxene-doped liquid metal (LM) method to achieve a stable solid−liquid composite interconnect (SLCI) between the rigid chip and stretchable interconnect lines. To overcome the surface tension of LM, a high-conductive Mxene is doped for the balance between adhesion and liquidity of LM. And the high-concentration doping could prevent the contact failure with chip pins, while the low-concentration doping tends to maintain the stretchability. Based on this dosage-graded interface structure, the solid light-emitting diode (LED) and other devices integrated into the stretchable hybrid electronic system could achieve an excellent conductivity insensitive to the exerted tensile strain. In addition, the hybrid electronic system is demonstrated for skin-mounted and tire-mounted temperature-test applications under the tensile strain up to 100%. This Mxene-doped LM method aims to obtain a robust interface between rigid components and flexible interconnects by attenuating the inherent Young's modulus mismatch between rigid and flexible systems and makes it a promising candidate for effective interconnection between solid electronics and soft electronics.

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Universal assembly of liquid metal particles in polymers enables elastic printed circuit board

Cited by 198 publications

References 50 publications

Low-melting-point alloys integrated extrusion additive manufacturing

Low-melting-point alloys integrated extrusion additive manufacturing

Liquid metal enabled conformal electronics

Graded Mxene-Doped Liquid Metal as Adhesion Interface Aiming for Conductivity Enhancement of Hybrid Rigid-Soft Interconnection

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