“…Because by using sputtering method, high reproducibility rates can be achieved and it is possible to control target and film compositions efficiently [5]. Moreover as a result of higher energy of the sputtered atoms, the adhesion of the film to substrate is better [14]. Therefore if compared to other deposition methods, especially when undesired composition changes with the source material and the deposited film is taken into account, sputtering method is advisable for NiCr deposition.…”