2022
DOI: 10.1364/oe.449895
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Up to 300 K lasing with GeSn-On-Insulator microdisk resonators

Abstract: GeSn alloys are the most promising direct band gap semiconductors to demonstrate full CMOS-compatible laser integration with a manufacturing from Group-IV materials. Here, we show that room temperature lasing, up to 300 K, can be obtained with GeSn. This is achieved in microdisk resonators fabricated on a GeSn-On-Insulator platform by combining strain engineering with a thick layer of high Sn content GeSn.

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Cited by 25 publications
(18 citation statements)
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“…Emission of the cavity provide the privilege of inspecting the spectral response from an internal source, overcoming the issues of coupling to an external waveguide and the resulting irrelevant resonant modes. Ge 9 , 10 and 22 24 alloys are being investigated as candidate materials for CMOS-compatible light sources. Thus, in our study we have integrated our design on a Ge micro-gear cavity (Fig.…”
Section: Resultsmentioning
confidence: 99%
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“…Emission of the cavity provide the privilege of inspecting the spectral response from an internal source, overcoming the issues of coupling to an external waveguide and the resulting irrelevant resonant modes. Ge 9 , 10 and 22 24 alloys are being investigated as candidate materials for CMOS-compatible light sources. Thus, in our study we have integrated our design on a Ge micro-gear cavity (Fig.…”
Section: Resultsmentioning
confidence: 99%
“…Namely, on-chip optical communications with two-dimensions of multiplexing—wave and space division multiplexing—for extremely high data-rates 31 . Consequently, Ge was chosen being a promising CMOS-compatible gain medium 9 , 10 , 25 29 , especially with the recent lasing reports of Ge and 22 24 , although the cavity concept applies to any waveguiding material. This is evident in the sharp-peak resonances observed in Fig.…”
Section: Discussionmentioning
confidence: 99%
“…Another direct literature comparison is the ref. [16] employing a relaxed Ge 0.831 Sn 0.169 laser structure that was fabricated using the same processing as for the present MMD. Both structures relax the residual as-grown compressive strain after layer transfer, but the Sn-content is however near 17 at%Sn in ref.…”
Section: Materials Characterizationmentioning
confidence: 99%
“…[13,15] applied to the GeSn layer with Sn content of ≈17% led to room temperature laser emission. [16,17] Strain engineering, combined with layer transfer technology, is a proven path to improve the lasing performance, thus avoiding the need for excessive Sn content in the active layer. [13,18] Indeed, as presented in this study, by relying on strain engineering one can directly address both the maximum lasing temperature, by tuning the CB directness, and the laser threshold, due to a smaller density of states of the light hole (LH) valence band involved in the transition.…”
Section: Introductionmentioning
confidence: 99%
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