2018
DOI: 10.1007/s10924-018-1189-4
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Urea Formaldehyde and Cellulose Nanocrystals Adhesive: Studies Applied to Sugarcane Bagasse Particleboards

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Cited by 30 publications
(14 citation statements)
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“…The TS and weight change (WC) with WA for fiberboards containing LCNF were lower than those for control fiberboards. Increase in viscosity was shown as the concentration of cellulose nanocrystals (NCC) to urea-formaldehyde (UF) adhesive increased for sugarcane bagasse particle boards [64]. The adhesive dispersion in the particleboard was prevented as NCC loading reached 5% due to the increase in viscosity.…”
Section: Modification Of Wood Adhesives With Nanocellulosementioning
confidence: 99%
“…The TS and weight change (WC) with WA for fiberboards containing LCNF were lower than those for control fiberboards. Increase in viscosity was shown as the concentration of cellulose nanocrystals (NCC) to urea-formaldehyde (UF) adhesive increased for sugarcane bagasse particle boards [64]. The adhesive dispersion in the particleboard was prevented as NCC loading reached 5% due to the increase in viscosity.…”
Section: Modification Of Wood Adhesives With Nanocellulosementioning
confidence: 99%
“…Natural fibers, such as palm kernel meal, sago fibers, and lignocellulosic waste fibers, have been investigated as fillers to prepare UF resin composite with improved performance [19][20][21]. However, their addition percentage is relatively low and high loading would prevent the effective dispersion in the particleboard [22]. Fiber dispersion has been identified as a major factor influencing the properties of fiber composite, and high addition increases their tendency to agglomerate.…”
Section: Introductionmentioning
confidence: 99%
“…Researchers have been studying new applications for SCB, and trying to bring about changes in a residue by product to create new products with more added value, such as composites (Loh et al, 2013;Mesquita et al, 2018;Oliveira et al, 2016b), and one example of these composites is the particleboard (Lee et al, 2006;Widyorini et al, 2005). Particleboards are normally produced with elements of the breakdown of wood (particles/chips), which are later combined with adhesive bonding under pressure and high temperature (Iwakiri, 2005;Kelly, 1977;Maloney, 1996).…”
Section: Introductionmentioning
confidence: 99%
“…They can be produced in single layers (chipboards) or in three layers (medium density particleboards -MDP). Regarding the raw material wood is the most used, although, any lignocellulosic material can be used for the particleboard production, such as SCB (Carvajal et al, 1996;Guler et al, 2016;Han et al, 2005;Hazrati-Behnagh et al, 2016;Jonoobi et al, 2016;Khazaeian et al, 2015;Lee et al, 2006;Mesquita et al, 2018;Oliveira et al, 2016a;Rangavar et al, 2016). One advantage of SCB is that, it can be easily converted into sliver particles, similarly as with wood (Driemeier et al, 2011;Garzón-Barrero et al, 2016;Hemmasi et al, 2011;Lee et al, 2006;Wu, 2001).…”
Section: Introductionmentioning
confidence: 99%