Use of an electrochemical probe for predictive assessment of bonded repair

Davis, Glyn; Harkless, Brian J.

doi:10.1016/s0143-7496(02)00011-8

Cited by 12 publications

(4 citation statements)

References 25 publications

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“…IS is a dynamic technique where a monochromatic signal, involving the single frequency V = /2 , is applied through a material volume and measuring the resulting phase delay and amplitude of the resulting current. Using this method, researches achieved a correlation between IS measurements and the internal integrity of several composite materials [21,22]. Fazzino et al [23] have successfully characterised progressive damage initiation and progression in thin woven glass/epoxy composites using IS.…”

Section: Introductionmentioning

confidence: 99%

Study of the Effect of Damage on the Electrical Impedance of Carbon Nanotube Reinforced Epoxy Nanocomposites

Bekas¹,

Paipetis

2015

Journal of Sensors

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Within the scope of this work is the study of the effect of damage on the electrical hysteretic behaviour of carbon nanotube (CNT) reinforced epoxy nanocomposites. For that purpose CNT reinforced epoxy nanocomposites were subjected to different levels of damage and their response to an AC voltage excitation was monitored. The correlation between frequency dependent impedance properties and level of damage was extensively studied. The AC frequency response of the interrogated specimens from 10 Hz up to 0.5 MHz revealed a strong correlation between the level of damage and the hysteresis of the studied materials.

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Section: Introductionmentioning

confidence: 99%

Study of the Effect of Damage on the Electrical Impedance of Carbon Nanotube Reinforced Epoxy Nanocomposites

Bekas¹,

Paipetis

2015

Journal of Sensors

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“…There was no practical means of measuring the ingress of moisture into the bondline prior to bond failure. Recently, moisture absorption has been tracked by measuring changes in the dielectric constant of the adhesive by electrochemical impedance spectroscopy (EIS) [14][15][16][17][18][19][20][21][22][23] and dielectric spectroscopy [24][25][26][27][28][29][30][31][32][33][34][35][36][37].…”

Section: Introductionmentioning

confidence: 99%

“…Davis and co-workers have adapted an EIS-based coating health sensor technology to detect the initial degradation of a bondline resulting from the ingress of moisture and to correlate the sensor measurements with mechanical properties [15][16][17][18][19][20][21][22][23]. This approach eliminates the immersion requirement and allows these measurements to be obtained under ambient conditions of an adhesive sandwiched between two adherends.…”

Section: Introductionmentioning

confidence: 99%

Detection of Moisture in Adhesive Bonds Using Electrochemical Impedance and Dielectric Spectroscopies

Davis¹,

Pethrick

Doyle

2009

Journal of Adhesion Science and Technology

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The ingress of moisture into an adhesive bonded structure can lead to a variety of effects. Moisture has the ability to plasticize the adhesive but may also segregate into microvoids. The water in the voids will have less of an effect as it does not plasticise the matrix and is unable to influence the interface between the resin and the substrate. Only if the T g of the matrix drops below ambient will it allow expansion of the voids and then there will be consequential lowering of the fatigue characteristics of the resin. Water also has the ability to interact with metallic surfaces leading to changes in the nature of the interaction between adhesive and adherend. Water has a large dipole signature and is easily studied in terms of its effect on the electrical properties of bonded joint structures. In this paper, applications of electrochemical impedance and dielectric spectroscopies are described. Both techniques measure the electrical response of the joint, however the nature of the measurement performed allows slightly different, but complementary, approaches to be adopted. Application of the techniques to similar joint structures illustrates the similarities and differences of the two approaches. The article demonstrates the value of using electrical methods to probe the changes that occur in joints on ageing and emphasizes the value of these methods in developing and understanding of the phenomena that are responsible for loss of bond integrity.

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“…Classical mechanical characterizations were carried out in parallel with non-destructive Electrochemical Impedance Spectroscopy (EIS) in order to detect the moisture ingress into the polymer. Indeed, in recent works, Davis and coworkers [7,8] showed that the EIS could effectively be applied to inspect adhesive bonds under humid conditions.…”

Section: Introductionmentioning

confidence: 99%

Characterization of adhesive ageing using mechanical and electrochemical inspection

Roy¹,

Touzain²

2006

Journal of Adhesion Science and Technology

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Two methacrylate adhesives, commonly used in railway applications, were tested before, during and after accelerated humid ageing. First, bulk tensile samples were fabricated in order to perform mechanical characterization before ageing. Then, the samples were placed in a humid environment and the influence of water on the Young's modulus and the tensile strength was determined. In parallel, Electrochemical Impedance Spectroscopy (EIS) measurements were carried out with methacrylate-adhesive-coated aluminum panels in order to extract parameters related to the porosity and adhesion of adhesives which are both dependent on water penetration. Finally, the mechanical characterization of adhesively-bonded lap joints with aluminum substrates was performed before and after accelerated humid ageing. All these experiments allowed to distinguish the two adhesives tested. It was found that the bulk adhesive samples which presented the best mechanical properties before ageing did not guarantee a good bonded-joint behavior after ageing. More importantly, the combination of EIS with mechanical tests allows to significantly reduce very much the number of experiments and, thus, the cost of industrial validation tests.

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Use of an electrochemical probe for predictive assessment of bonded repair

Cited by 12 publications

References 25 publications

Study of the Effect of Damage on the Electrical Impedance of Carbon Nanotube Reinforced Epoxy Nanocomposites

Study of the Effect of Damage on the Electrical Impedance of Carbon Nanotube Reinforced Epoxy Nanocomposites

Detection of Moisture in Adhesive Bonds Using Electrochemical Impedance and Dielectric Spectroscopies

Characterization of adhesive ageing using mechanical and electrochemical inspection

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