2013
DOI: 10.1002/pssb.201200959
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Use of dynamic compression to probe semiconductor response at large strains

Abstract: Phone: þ1 509 335 2498, Fax: þ1 509 335 6115Large strains in semiconductors are expected to be more common in future electronic devices utilizing nanostructure components. Hydrostatic pressure (HP) and uniaxial stress (US) loading have inherent limitations for probing the desired strain conditions. Uniaxial strain loading, achieved in dynamic compression experiments, is particularly attractive for attaining well-defined, large strains and to complement HP and US loading. Recent dynamic compression studies on I… Show more

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Cited by 2 publications
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“…Probing semiconductors at highly anisotropic strains is diffi cult due to the inherent limitations of the commonly used static compression methods to generate the hydrostatic pressure or uniaxial stress. The uniaxial strain conditions produced during strong dynamic compression can overcome these limitations and have revealed lately important electronic structure changes [3]. From the more technological point of view several papers deal with investigations of laser diodes under high pressure.…”
mentioning
confidence: 99%
“…Probing semiconductors at highly anisotropic strains is diffi cult due to the inherent limitations of the commonly used static compression methods to generate the hydrostatic pressure or uniaxial stress. The uniaxial strain conditions produced during strong dynamic compression can overcome these limitations and have revealed lately important electronic structure changes [3]. From the more technological point of view several papers deal with investigations of laser diodes under high pressure.…”
mentioning
confidence: 99%