Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging

Huang, De-Shau; Tu, Wenbin; Zhang, Xiuming; Tsai, Liang-Te; Wu, Ti-Yuan; Lin, Ming-Tzer

doi:10.1016/j.microrel.2016.07.006

Cited by 3 publications

(2 citation statements)

References 5 publications

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“…Nowadays, the major trends in the electronic packaging are more functionality, smaller size, thinner packages and higher density, which requires film to be thinner and thinner [1][2][3][4][5]. Cobalt film as magnetic film has been widely used in electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method

Jiang

Zhang

Liu

2019

Acta Metall. Sin. (Engl. Lett.)

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Target assembly is a key consumable material for producing thin film used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m 2 K) cooling condition corresponding to the actual air cooling process were studied, based on finite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target-solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly.

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Section: Introductionmentioning

confidence: 99%

Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method

Jiang

Zhang

Liu

2019

Acta Metall. Sin. (Engl. Lett.)

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“…Indeed, the functioning and useful life of packaged electronic assembly depend seriously on advanced electronic packaging materials. Electrical conduction, electrical insulation, mechanical support, environmental protection, and thermal conduction and dissipation are the main functions that should be considered [6,7]. Heat sinks, which are the cooling systems for electronic devices, have been developed to solve this issue.…”

Section: Introductionmentioning

confidence: 99%

New Nanocomposite Materials with Improved Mechanical Strength and Tailored Coefficient of Thermal Expansion for Electro-Packaging Applications

Saboori

Moheimani

Pavese

et al. 2017

Metals

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Abstract:In this research, copper nanocomposites reinforced by graphene nanoplatelets (GNPs) were fabricated using a wet mixing method followed by a classical powder metallurgy route. In order to find the best dispersion technique, ball milling and wet mixing were chosen. Qualitative evaluation of the structure of the graphene after mixing indicated that the wet mixing is an appropriate technique to disperse the GNPs. Thereafter, the influence of graphene content on microstructure, density, hardness, elastic modulus, and thermal expansion coefficient of composites was investigated. It was shown that by increasing the graphene content the aggregation of graphene is more obvious and, thus, these agglomerates affect the final properties adversely. In comparison with the unreinforced Cu, Cu-GNP composites were lighter, and their hardness and Young's modulus were higher as a consequence of graphene addition. According to the microstructural observation of pure copper and its composites after sintering, it was concluded that grain refinement is the main mechanism of strengthening in this research. Apart from the mechanical characteristics, the coefficient of thermal expansion of composites decreased remarkably and the combination of this feature with appropriate mechanical properties can make them a promising candidate for use in electronic packaging applications.

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An intelligent model for assuring food quality in managing a multi-temperature food distribution centre

Tsang

Choy

et al. 2018

Food Control

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Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging

Cited by 3 publications

References 5 publications

Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method

Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method

New Nanocomposite Materials with Improved Mechanical Strength and Tailored Coefficient of Thermal Expansion for Electro-Packaging Applications

An intelligent model for assuring food quality in managing a multi-temperature food distribution centre

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