2023
DOI: 10.1088/1361-6439/acd25d
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Vapor etching to avoid micro-masking by gas-bubbles in wet release of MEMS

Abstract: We report on the formation of gas bubbles during the release of MEMS devices using buffered oxide etch. Several approaches to mitigate the problem are proposed and tested together with a qualitative study of the phenomenon. The chemical reaction behind such phenomenon and the influence of defects and topography is discussed. Finally, a comparison with the HF-vapor release technique is shown.

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