2011
DOI: 10.1016/j.tsf.2011.01.316
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Variation of microstructure and transport properties with filament temperature of HWCVD prepared silicon thin films

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Cited by 6 publications
(4 citation statements)
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“…The calculated value of β crystallite size was found ~ 5 nm. These results are in consistent with the nc-Si:H films prepared by hot wire method at different filament 32 temperatures by Gogoi et al…”
Section: Low Angle Xrd Analysissupporting
confidence: 92%
“…The calculated value of β crystallite size was found ~ 5 nm. These results are in consistent with the nc-Si:H films prepared by hot wire method at different filament 32 temperatures by Gogoi et al…”
Section: Low Angle Xrd Analysissupporting
confidence: 92%
“…This result is contrary to the general observation during the typical HWCVD process. In general, the deposition rate of Si films is increased with increasing wire temperature in the HWCVD process (Heintze et al 1996;Gogoi et al 2011) because the decomposition efficiency of the reactants increases with increasing wire temperature. Such a difference in the dependence of the wire temperature on deposition is believed to come from the difference in the reactor pressure; the working pressure is less than 0.5 torr in the general HWCVD process whereas it is 1.5 torr in the current experiment.…”
Section: Resultsmentioning
confidence: 99%
“…These radicals may further undergo chain gas phase reactions and get modified before getting deposited at the substrate. This method has advantageous over conventional PE-CVD method in several ways; (i) absence of plasma assisted process leads to less lightinduced degradation in the HWCVD films [12,13] (ii) lack of ion bombardment on the growing film surface which is responsible for creation of defects in the films and thus deterioration of device performance [14]; (iii) high deposition rates [15] by the process of efficient catalytic cracking of the feed gases into film forming radicals; (iv) feed stock gases are utilized much more efficiently, thus reducing the processing cost further [16]; (v) films made by this method have less stress than those made by PE-CVD method [17]; (vi) films grown using this method have improved stability against the light-induced degradation [18]; (vii) both a-Si:H and μc/nc-Si:H films can be prepared at low substrate temperature [19,20] without losing the material quality. This opens up the possibility of using low cost and flexible substrates like plastics.…”
Section: Introductionmentioning
confidence: 99%