“…Various solution-processing methods can be utilized to deposit CuSCN at low temperatures, including spin-coating, 11 , 20 , 25 ink-jet printing, 26 , 27 doctor blading, 28 , 29 and electrochemical deposition. 30 − 32 These advantages enable the growth of CuSCN films with thicknesses in the range from 10 to several 100 s of nanometers, which facilitates the application of CuSCN in p-channel thin-film transistors (p-TFTs). 33 , 34 Solvents, such as diethyl sulfide (DES) and dipropyl sulfide, are commonly used to dissolve CuSCN.…”