2013
DOI: 10.1016/j.microrel.2013.07.053
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Variations in junction capacitance and doping activation associated with electrical stress of InGaN/GaN laser diodes

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Cited by 9 publications
(1 citation statement)
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“…8,[19][20][21][22] Its value was chosen in order to minimize second-order effects that can be present in devices submitted to thermal storages such as the variation of the series resistance, 23 the degradation of the ohmic contact, 24 possible changes in the composition of the quantum wells, 25,26 problems related to the passivation, 27 and the activation of the p-type dopant. [28][29][30] All these mechanisms concur with the annealing of the irradiation-generated defects at high temperature, and can lead to an erroneous identification of the physical cause responsible for the variation of the characteristics during the recovery tests.…”
mentioning
confidence: 99%
“…8,[19][20][21][22] Its value was chosen in order to minimize second-order effects that can be present in devices submitted to thermal storages such as the variation of the series resistance, 23 the degradation of the ohmic contact, 24 possible changes in the composition of the quantum wells, 25,26 problems related to the passivation, 27 and the activation of the p-type dopant. [28][29][30] All these mechanisms concur with the annealing of the irradiation-generated defects at high temperature, and can lead to an erroneous identification of the physical cause responsible for the variation of the characteristics during the recovery tests.…”
mentioning
confidence: 99%