“…However, the low thermal conductivity of polymer materials (in the range of 0.1–0.5 W m −1 K −1 ), 3 significantly restricted their applications in electronics thermal management. Compositing with various thermal conductive fillers, including metal particles (Al, 4 Cu, 5 and Ag 6 ), ceramic particles (Al 2 O 3 , 7 BN, 8 AlN, 9 and SiC 10 ), and carbon-based materials (carbon fiber, 11–13 diamond, 14 graphene, 15,16 CNT, 17 and graphite flake 18 ), have been used to enhance the thermal conductivity of polymers.…”