Vertical comb-drive MEMS mirror with sensing function for phase-shift device

Oda, Kentaro; Terao, Kyohei; Suzuki, Takao; Takao, Hidekuni; Ishimaru, Ichiro; Oohira, Fumikazu

doi:10.1109/omems.2010.5672213

Cited by 3 publications

(2 citation statements)

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“…Indeed, most MOEMS phase shifter for interferometric applications are based on this approach. Typically, the vertical displacement of micromirrors is generated by employing either the classic comb-drive microactuators and levitation force [6], or the asymmetric comb-drive structures with vertical offset [7] or even comb-drives without offset, based only on fringe effect [8]. The latter method is advantageous due to simplified technology, since the vertical micro-actuator is fabricated by formation of two sets of fingers with different height in the same device layer of SOI wafer, as proposed first by Tsuchiya et al [9].…”

Section: Introductionmentioning

confidence: 99%

Vertical comb-drive microscanner with 4x4 array of micromirrors for phase-shifting Mirau microinterferometry

et al. 2016

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In this paper, we present construction, fabrication and characterization of an electrostatic MOEMS vertical microscanner for generation of an optical phase shift in array-type interferometric microsystems. The microscanner employs asymmetric comb-drives for a vertical displacement of a large 4x4 array of reference micromirrors and for in-situ position sensing. The device is designed to be fully compatible with Mirau configuration and with vertical integration strategy. This enables further integration of the device within an "active" multi-channel Mirau micro-interferometer and implementation of the phase shifting interferometry (PSI) technique for imaging applications. The combination of micro-interferometer and PSI is particularly interesting in the swept-source optical coherence tomography, since it allows not only strong size reduction of a system but also improvement of its performance (sensitivity, removal of the image artefacts). The technology of device is based on double-side DRIE of SOI wafer and vapor HF releasing of the suspended platform. In the static mode, the device provides vertical displacement of micromirrors up to 2.8µm (0 -40V), whereas at resonance (fo=500 Hz), it reaches 0.7 µm for only 1VDC+1VAC. In both operation modes, the measured displacement is much more than required for PSI implementation (352nm peak-to-peak). The presented device is a key component of array-type Mirau micro-interferometer that enables the construction of portable, low-cost interferometric systems, e.g. for in vivo medical diagnostics.

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Section: Introductionmentioning

confidence: 99%

Vertical comb-drive microscanner with 4x4 array of micromirrors for phase-shifting Mirau microinterferometry

et al. 2016

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“…The single crystal silicon(SCS)-based micromachining and the silicon on insulator (SOI)-based micromachining are the most popular techniques in the MEMS field, which have been used to fabricate such features as clamped beams, membranes, cantilevers, grooves, orifices, springs, gears, suspensions, etc [1][2][3][4][5][6][7]. With the present micro fabrication techniques, process difference is inevitable which leads to change in geometrical dimensions of the MEMS product and causes variability in the product performance.…”

Section: Introductionmentioning

confidence: 99%

Fabrication Comparison of the SCS-Based and SOI-Based Micromachining

Chen

et al. 2014

AMR

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The two different fabrications of the Micro-Electro-Mechanical Systems (MEMS) mirrors were compared: a single-crystal-silicon (SCS)-based micromachining and a silicon-on-insulator (SOI)- based micromachining. While the SOI parts had significantly smaller curved device appearance, they were outperformed in most areas by the SCS parts. This was due primarily to the smaller stress factor in the device layer in the SOI parts compared to the polysilicon layer used in the SCS parts.

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