2008
DOI: 10.1016/j.mee.2008.09.012
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Vertically stacked non-volatile memory devices – material considerations

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Cited by 40 publications
(60 citation statements)
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“…The most promising one is the 3D-like, with active elements stacked one over another. The research on such devices is very advanced in the case of so-called cross-bar memories [1], which are shortly described below.…”
Section: Zno For 3d Memory Devicesmentioning
confidence: 99%
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“…The most promising one is the 3D-like, with active elements stacked one over another. The research on such devices is very advanced in the case of so-called cross-bar memories [1], which are shortly described below.…”
Section: Zno For 3d Memory Devicesmentioning
confidence: 99%
“…This similarity means that as in the case of ICs miniaturization limit will soon be achieved and that we need another approach to increase further a memory storage capacity. One of the most studied ideas here is based on vertically stacked memory cells (cross-bar memory) (see, e.g., [1][2][3]). The storage density of such memory devices depends on 4F 2 /n ratio, where F is a node standard (e.g., 65 nm) and n number of stacks.…”
Section: Zno For 3d Memory Devicesmentioning
confidence: 99%
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