VISA: Integration of electronic components in PCB based technology for automotive electronics

Hofmann, Thomas; Gottschling, Stefan; Neumann, Alexander

doi:10.1109/siitme.2011.6102678

Cited by 3 publications

(1 citation statement)

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“…Another term, System in package (SiP), is widely used for chip components integrating different silicon chips in one package, but applies also to components embedded in a PCB treated rather as a functional module or a functional PCB component to be attached to a system to extend its functionality. This aspect is widely explained in Boettcher et al (2008) and Hofmann et al (2011). PCB manufacturers enrich their offerings with embedded components; however, the maturity of the technological process is not always yet proven.…”

Section: Introductionmentioning

confidence: 99%

Embedding components in voltage converter PCB for size reduction and heat management

et al. 2016

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Purpose – The purpose of this paper was to show physical limitation of embedding standard packaging components into printed circuit board (PCB) which is more reasonable technology for small series productions which is popular in industrial products. Embedding electronic components inside a PCB FR-4 substrate leads to significant size reduction and better heat management. Embedded chip technology is already known in many consumer electronics applications, but it is focused on high volumes and required to order components ready to be embedded. Design/methodology/approach – Highly integrated DC/DC converter with standard-package electronic parts (passive and active) was embedded inside a PCB structure. The design and the manufacturing process was based on standard PCB FR-4 technology. Sandwich solution was used to integrate all layers together; one of the main investigations was to focus on how to fill space around components to keep internal stresses on very low level. Findings – There were few considerations during choosing the right concept. The first, which occurred during the first producing round, was the distance between thick copper and inner layer. The second one was the way how to fill space between mounted components on inner layer and isolation laminate. A few trials took place and it is decided that it is impossible to fill this space with resin from prepregs; therefore, a casting compound was used. Originality/value – Design and manufacturing process which brings 37 per cent of size reduction of complete DC/DC voltage converter PCB with 28.5 W output power comparing to a reference design with standard surface mounted devices (SMD) and copper layout implementation has been achieved during research project.

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Section: Introductionmentioning

confidence: 99%