Viscous and magnetic properties of liquid Cu–25 wt.% Sn alloy

Hou, Jixin; Guo, Haiyan; Zhan, ChengWei; Tian, Xuelei; Chen, Xichen

doi:10.1016/j.matlet.2005.12.108

Cited by 9 publications

(7 citation statements)

References 13 publications

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“…In the same temperature zone, e and v m related by the Arrhenius equation are independent of temperature, but dependent on the liquid structure and the size of the fluid cluster. 5 The changes of e and v m indicate that there was a structural transition in each liquid solder. For the Sn-0.7Cu melt, the transition occurred at the temperature range from 553 K to 573 K, whereas the transition temperature was between 573 K and 603 K in the Sn-2Cu melt.…”

Section: Structural Transition In the Solder Meltsmentioning

confidence: 98%

“…The variations of e and v m reflect the change of liquid structure of the melt. 5 In our previous work, 14 the liquid structures of Sn-0.7Cu and Sn-2Cu solders were studied using a high-temperature x-ray diffractometer. The structure factor S(Q) is shown in Fig.…”

Section: Structural Transition In the Solder Meltsmentioning

confidence: 99%

“…4 Viscosity is an important physical property of liquids, and studies on viscosity are attracting increasing interest in both technical and theoretical fields of condensed matter physics. 5 In the process of electronic packaging, viscosity is also one of the key material properties affecting underfill flow, gap filling, and solderability. [6][7][8] In addition, by knowing the viscosity of a solder alloy, surface tension can also be calculated, which is quite significant since it is rather difficult to measure directly.…”

Section: Introductionmentioning

confidence: 99%

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Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders

Zhao

Pan

et al. 2009

Journal of Elec Materi

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The viscosity of Sn-0.7wt.%Cu and Sn-2wt.%Cu lead-free solders was measured using a torsional oscillation viscometer from 503 K to 773 K. For both melts the viscosity decreased with increasing temperature, and the values dropped abruptly at certain temperature ranges, i.e., 553 K to 573 K for Sn-0.7Cu and 573 K to 603 K for Sn-2Cu. Correspondingly, two segments, a low-temperature zone and a high-temperature zone, were found on both g-T and ln g-1/T plots, where g is the viscosity and T is the absolute temperature. The activation energy e and the unit volume of flow m m were obtained by applying the parameters of linear fitting for each temperature zone. The surface tension of the solders was calculated using the measured viscosity values, and the results were checked by measuring the wetting angles of metallurgical reactions between the solders and the Cu substrates. Both viscosity and surface tension are closely related to the liquid structure of the solder alloy.

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Section: Structural Transition In the Solder Meltsmentioning

confidence: 98%

Section: Structural Transition In the Solder Meltsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders

Zhao

Pan

et al. 2009

Journal of Elec Materi

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“…The casting process includes the placement of a metal pattern in the mold (a), the mold is filled with sand (b), the cast metal is poured into the sand mold (c) and the results of the cast product (d). Figure 6 shows the fluidity length of Cu (20)(21)(22)(23)(24)wt.%Sn at pouring temperature 1100 ºC. The increasing in pouring temperatures and the cavity thickness can increase the fluidity length [20].…”

Section: Methodsmentioning

confidence: 99%

“…The rapid solidification rate has caused the decreasing phase of α and increasing the α + δ phase. The increasing of dendrite grain has caused the decreasing of the tensile strength and the increasing the hardness of Cu (20)(21)(22)(23)(24)wt.% Sn [19].…”

Section: Introductionmentioning

confidence: 99%

Effect of composition and pouring temperature of Cu(20-24)wt.%Sn by sand casting on fluidity and mechanical properties

Slamet

Suyitno

Kusumaningtyas

2019

JMES

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The effect of tin composition and pouring temperature on the length of fluidity, microstructure, density, hardness, tensile strength and bending of Cu-Sn alloy with sand casting method has been investigated. Cu(20-24)wt.%Sn were casted in two different pouring temperatures (1000 ºC and 1100 ºC) in strip plate pattern sand mold. The sand mold has a length of 400 mm, width of 10 mm with a thickness of the mold cavity varied from 1.5 to 5 mm. The results show that the increase in composition (20-22) wt.% Sn decreases the length of fluidity while the composition (22-24) wt.% Sn length fluidity increase again. Increase of the pouring temperature and mold cavity thickness can increase the length of fluidity. Increasing tin composition and pouring temperature can increase the phase of α structure, porosity, hardness of the alloy and trigger the growth of dendrite columnar and secondary dendrite (DAS) microstructure.While the density, tensile strength and bending strength of the alloy tend to decrease. Increasing tin composition and pouring temperature in Cu(20-24) wt.% Sn caused the alloy to be more brittle.

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Statistical analysis and susceptibility properties of heavy/light metal pollution in surface seawater of Izmir Bay

Şabikoğlu

2021

Environ Sci Pollut Res

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Viscous and magnetic properties of liquid Cu–25 wt.% Sn alloy

Cited by 9 publications

References 13 publications

Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders

Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders

Effect of composition and pouring temperature of Cu(20-24)wt.%Sn by sand casting on fluidity and mechanical properties

Statistical analysis and susceptibility properties of heavy/light metal pollution in surface seawater of Izmir Bay

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