With the booming development of communication technology and electronic equipment, the leakage of electromagnetic waves causes serious damages to the sensitive electronic equipment and electronic components, resulting in the instability or loss of control of electronic devices in aerospace, weapon equipment, and wearable devices. [1][2][3][4] Moreover, it brings great harm to human blood, immune system, reproductive system, and embryo development. [5][6][7] To ensure the normal operation of electronic equipment and protect human health, it is necessary to use electromagnetic interference (EMI) shielding materials to block electromagnetic waves. To date, metals are the most widely used modern industrial EMI shielding materials because of their high electrical conductivity and outstanding EMI shielding effectiveness (SE). [8,9] However, owing to their high mass density, poor flexibility, inferior corrosion resistance, and difficult processibility, the metal materials cannot meet the miniaturization, lightweight, and integration requirements for electronic and communication equipment. Moreover, the reflected electromagnetic waves on the surface of metals due to poor impedance mismatching cause the secondary pollution problems. [10,11] Recently, the conductive polymer composites (CPCs) with one single or hybrid conductive fillers dispersed in the single-phase or multiphase polymer matrix have taken great attention. [12][13][14] Compared with the traditional metal materials, CPCs show a wide application prospect due to their advantages of low density, [15] excellent corrosion resistance, [16] good chemical stability, [17] easy processing, [18] and low cost. [19] Nevertheless, to obtain the desirable EMI shielding performances, high filling amounts of conductive fillers are usually needed, which is disadvantageous to the mechanical properties and processibility of CPCs due to the agglomeration of conductive fillers. [20,21] Constructing conductive segregated structures is an effective strategy to decrease the conductive percolation threshold and enhances the EMI SE of CPCs. In comparison with the homogeneous structures, the unique segregated structures with conductive fillers selectively distributed at the interfaces between adjacent polymer microregions show high-efficiency continuous 3D conductive networks. This leads to the decreased percolation threshold, significantly improved electrical conductivities and EMI shielding performances. [22][23][24] Yan et al. [25] assembled the reduced graphene oxide (rGO) on polystyrene (PS) particles, and prepared the segregated PS@rGO composites via