VPS technology and applications

Plotog, Ioan; Varzaru, Gaudentiu; Svasta, Paul

doi:10.1109/iseee.2010.5628465

Cited by 10 publications

(6 citation statements)

References 3 publications

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“…As a result, soldering proceeds in an inert atmosphere. Heat transfer is linear with delivered heating energy (Plotog et al, 2010). After removing boards from the soldering chamber, the fluidic inert layer evaporates from the devices without leaving sediment on the surface.…”

Section: Introductionmentioning

confidence: 99%

Voids investigation in solder joints performed with vapour phase soldering (VPS)

Synkiewicz

Skwarek

Witek

2014

Soldering &Amp; Surface Mount Technology

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Purpose – The main advantages of vapour phase soldering are a non-oxygen environment, the elimination of overheating and the possibility of the vacuum application, which can guarantee undeniably higher quality of solder joints, especially as regards void formation. These features are less affected by the alloy composition. The paper aims to discuss these issues. Design/methodology/approach – The quality of solder joints made in two VPS options (with and without vacuum) was investigated in terms of voids formation. Solder alloys of 37%Pb63%Sn (PbSn) and 96%Sn3.5%Ag0.5%Cu (SAC 305) were applied to an etched Cu layer on a glass-epoxy substrate using the screen-printing method. 1206 SMD resistors were placed on the solder pads with a Quadra pick-and place machine. For the inspection of joint structure and void identification, 3D X-ray images of samples were taken using a computed tomography system with a 180 kV/15 W nanofocus. For comparison, traditional cross-sections of the samples were performed using a metallographic polisher. The cross-section analysis was done in a scanning electron microscope (SEM). To confirm the relevance of these data, a statistical analysis was carried out. Findings – The paper shows that alloy composition has less impact on the quality of joints as regards void formation. The tendency for a different arrangement of voids in a junction depending on the distance SMD element and the thickness of the solder layer was investigated using X-ray computed tomography. Originality/value – The use of 3D computed tomography for void investigation gives full information about the internal structure of the joint and allows for precise void identification. Vacuum application during the soldering allows significant voids elimination.

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Section: Introductionmentioning

confidence: 99%

Voids investigation in solder joints performed with vapour phase soldering (VPS)

Synkiewicz

Skwarek

Witek

2014

Soldering &Amp; Surface Mount Technology

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“…The maximum temperature of the sample cannot exceed the Agata Skwarek, Beata Synkiewicz, Krzysztof Witek, and Sebastian Wronski Application of Vapor Phase Soldering (VPS) for Joints Reliability Improvement boiling point of the medium. After moving the samples from the heating zone, the vapor of the medium is evaporated [7]. A scheme of the VPS process is presented in Fig.…”

Section: A Vapor Phase Solderingmentioning

confidence: 99%

Application of Vapor Phase Soldering (VPS) for Joints Reliability Improvement

Skwarek¹,

Synkiewicz²,

Witek³

et al. 2013

IJMO

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Abstract-The reliability of an electronic system may depend on solder joint work. Various methods are used at present to improve joint reliability One possibility is vapor phase soldering (VPS). The biggest advantages of VPS are high efficiency and uniform heating characteristics. It is also possible to ensure good control of the soldering temperature, an oxygen free soldering atmosphere, and, especially a higher rate of heat transfer. Joints made with VPS can be more uniform with fewer defects than in joints made with reflow soldering. However, the choice of solder alloy used for VPS may be a key factor in the quality of the junction.Index Terms-Solder joints, vapor phase soldering, ceramic elements.

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“…Like the other reflow methods in electronics manufacturing, temperature in VPS processes is usually measured with thermocouples (TCs). The VPS functionality is based on the Galden-type heat transfer fluid, which is heated in the bottom of the VPS tank, until the point of boiling; the vapour will start to distribute into the oven up until the level of the cooling system, which controls the limit of the vapour height (Plotog et al, 2010;Branzei, 2012). The hot vapour will cover the surface of the immersed PCB during the reflow process.…”

Section: Introductionmentioning

confidence: 99%

Effect of different thermocouple constructions on heat-level vapour phase soldering profiles

Alaya

Megyeri

Busek³

et al. 2020

SSMT

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Purpose To improve productivity and reach better quality in assembling, measurements and proper process controlling are a necessary factor. This study aims to focus on the monitoring heat-level-based vapour phase reflow soldering (VPS), where – as it was found – different thermocouple constructions can affect the set parameters of the oven and resulting soldering profiles significantly. Design/methodology/approach The study experiments showed significant alteration of the heating profiles during the process of the reflowing using different construction of k-type thermocouples. In a heat-level-based VPS oven, polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA) gas and water-resistant, fibreglass, thin PFA and ultrathin PFA-covered thermocouples were tested with ±1 °C precision. The oven parameters were swept according to the heating power; the length of the introduced thermocouple cables was also taken into account. An FR4-based sample PCB was used for monitoring the temperature. Findings According to the results, due to the mass and volume of the thermocouples’ wires, different transients were observed on the resulting soldering profiles on the same sample PCB. The thermocouples with lower thermal mass result in faster profiles and significantly different heating factor values compared to the thermocouples that have larger thermal mass. Consequently, the length of the thermocouple wires put in the oven has also considerable effect on the heat transfer of the PCB inside the oven as well. Originality/value The paper shows that the thermocouple construction must be taken into account when setting up a required soldering profile, while the thermal mass of the wires might cause a significant difference in the prediction of the actual and expected soldering temperatures.

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VPS technology and applications

Cited by 10 publications

References 3 publications

Voids investigation in solder joints performed with vapour phase soldering (VPS)

Voids investigation in solder joints performed with vapour phase soldering (VPS)

Application of Vapor Phase Soldering (VPS) for Joints Reliability Improvement

Effect of different thermocouple constructions on heat-level vapour phase soldering profiles

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