2018
DOI: 10.1109/tcpmt.2017.2780102
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Wafer-Level AuSn/Pt Solid–Liquid Interdiffusion Bonding

Abstract: In this paper, wafer-level AuSn/Pt solid-liquid interdiffusion bonding for hermetic encapsulation of microelectromechanical systems (MEMS) is evaluated. Although AuSn is used for bonding of ICs, the implementation of AuSn diffusion bonding in MEMS applications requires thorough understanding of its compatibility with the complete layer stack including adhesion, buffer, and metallization layers. Partitioning of the layer stacks is possible in MEMS devices consisting of several silicon wafers since the device wa… Show more

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Cited by 17 publications
(7 citation statements)
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“…The samples were soldered in air muffle furnace at 320 °C for 100 s, 500 s and 2500 s by utilizing flux (Weller T0051383199), and air cooled to room temperature. The bonding procedures regarding time and temperature were selected to mimic wafer-level bonding conditions utilized for Au-Sn and Cu-Sn bonds [4,5,8,10,[43][44][45][46][47][48]. The high temperature storage (HTS) aging test at 150°C was conducted with a Heraeus Instruments oven for 500 and 1000 hours.…”
Section: Methodsmentioning
confidence: 99%
“…The samples were soldered in air muffle furnace at 320 °C for 100 s, 500 s and 2500 s by utilizing flux (Weller T0051383199), and air cooled to room temperature. The bonding procedures regarding time and temperature were selected to mimic wafer-level bonding conditions utilized for Au-Sn and Cu-Sn bonds [4,5,8,10,[43][44][45][46][47][48]. The high temperature storage (HTS) aging test at 150°C was conducted with a Heraeus Instruments oven for 500 and 1000 hours.…”
Section: Methodsmentioning
confidence: 99%
“…The Au-Sn SLID bonding requires high material thicknesses when the liquid forming material is the Sn layer between the base Au layers unless the bonder has a very high heating rate [28], [29]. This work implements the Au 80 Sn 20 eutectic composition in the liquid form during the SLID bonding to overcome the critical thickness requirement of the Au-Sn material system.…”
Section: Design Considerationsmentioning
confidence: 99%
“…Bonding techniques for Au-Sn microbumps encompass eutectic bonding and solid-liquid interdiffusion (SLID) bonding. Eutectic bonding technology is widely used due to its low bonding pressure and capacity for high-density integration [8][9][10][11][12][13].…”
Section: Introductionmentioning
confidence: 99%