2007 Proceedings 57th Electronic Components and Technology Conference 2007
DOI: 10.1109/ectc.2007.373857
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Wafer-Level Glass Capping as Drop-in for Miniaturized, Advanced Optical COB Packaging

Abstract: The novel wafer-level packaging (WLP) process described in this paper allows quasi-hermetic capping of optical devices on wafer-level yielding miniaturized glass cavity windows on top of the optical area, at the same time leaving the contact area accessible for standard electrical connections i.e. wire bond. These smaller chip-size optical cavity packages are used within standard chip-on-board (COB) assemblies for high performance optical applications providing high yield and utmost reliability.In this paper t… Show more

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