Wafer level packaging of a tape flip-chip chip scale packages

Hotchkiss, G. B.; Amador, Gonzalo; Edwards, D.; Hundt, Paul; Stark, L.; Stierman, R.J.; Heinen, G.

doi:10.1016/s0026-2714(00)00261-4

Cited by 9 publications

(1 citation statement)

References 4 publications

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“…1 Clearly, the trend to reduce the size of electronic packages and develop increasingly sophisticated electronic devices with more and higher density inputs/outputs leads the use of area array packages using the CSP, flip chip, and wafer level packaging technologies. 2 The use of ball grid array ͑BGA͒ and micro-ball grid array ͑micro-BGA͒ as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph

2004

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We describe a simple way to effectively measure the height of a micro-solderball of a micro-ball grid array (micro-BGA) on a bumped wafer. The proposed method derived using a white-light illumination source can perform a speedy whole field inspection of the microsolderballs. The optical system consists of a white-light telecentric configuration and a long-working-distance microscope with a telecentric objective. The optical axes of the illuminating light and microscope are symmetrically arranged with respect to the normal of the test surface and hence the technique is applicable to optical measurement on a mirrorlike test surface, such as a silicon wafer. The height of a solderball is computed from a simple formula based on the geometry of the specimen and the system configuration. Experimental results demonstrate that the height of a micro-solderball can be readily measured with accuracy in the order of micrometers.

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Section: Introductionmentioning

confidence: 99%