Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek‐Soo

doi:10.3390/polym7060985

Cited by 28 publications

(8 citation statements)

References 46 publications

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“…The curvature of the EMC/Cu bi-layer package was measured according to temperature using 3D-DIC (ARAMIS, GOM, Germany). 37 The EMC/Cu bi-layer package was sprayed with a white ceramic pattern for tracking patterns using the DIC method in the same way as the modulus measurement.…”

Section: Effective Cure Shrinkage (Ecs) Of the Emcmentioning

confidence: 99%

Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

Park

Kim

et al. 2023

ACS Appl. Mater. Interfaces

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Semiconductor packaging continues to reduce in thickness following the overall thinning of electronic devices such as smartphones and tablets. As the package becomes thinner, the warpage of the semiconductor package becomes more important due to the reduced bending stiffness and driven by thermal residual stresses and thermal expansion mismatch during the epoxy molding compound (EMC) curing to create the package. To address this packaging reliability issue, in this study, we developed a modified cure cycle that adds a rapid cooling step to the conventional cure cycle (CCC) to enhance the reliability of the EMC molded to a copper substrate (EMC/Cu bi-layer package) by lowering the bonding temperature of the EMC/Cu bi-layer package. Modeling of the package via Timoshenko theory including effective cure shrinkage allowed the rapid cooling step to be quantified and confirmed via experiments. The modified cure cycle resulted in a 26% reduction in residual strain, a 27% reduction in curvature, and a 40% increase in peel strength compared to the CCC, suggesting that this is an effective new method for managing warping effects in such packaged structures.

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Section: Effective Cure Shrinkage (Ecs) Of the Emcmentioning

confidence: 99%

Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

Park

Kim

et al. 2023

ACS Appl. Mater. Interfaces

Self Cite

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“…The technique offers a better value compare to a conventional probe gauge where an accurate measurement is difficult to achieve in deformed or curved surfaces. Furthermore, this method was suggested by researchers as an efficient way to capture features detail in short time whether in small or large scale [35].…”

Section: Surface Deformationmentioning

confidence: 99%

Experimental Investigation of Plasma Cutting Two Separate Thin Steel Sheets Simultaneously and Parameters Optimisation Using Taguchi Approach

Gani

Ion

Yang

2021

Journal of Manufacturing Processes

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“…Furthermore, this method was suggested by researchers as an efficient way to capture features detail in short time. 18 GOM inspect was used as a software to analyse the maximum deformation of each specimen. Gaussian best fit virtual plan method was used to construct the reference to measure the level.…”

Section: Surface Deformation Measurementmentioning

confidence: 99%

Optimisation of cutting parameters and surface deformation during thin steel sheets plasma processing using Taguchi approach

Gani

Ion

Yang

2021

Advances in Mechanical Engineering

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Plasma machining was investigated for suitability to cut thin sheets and the quality obtained was assessed. The aim of this research was to analyse the impact of the heat generated from plasma cutting on thin sheet surface deformation and heat affected zones. Plasma cutting was assumed to be noneffective for processing thin material, this technology was known primely for cutting medium to thick plates. Tremendous work was performed previously to improve the quality. However, there are no scientific publications assessed the effect of the plasma heat on thin material under 1 mm and optimised optimise the process to reduce the phenomena resulted to their minimal. The traditional cutting methods were found to be limited and time consuming. This research can be beneficial for vehicle convertors such as wheelchair accessible vehicles or similar industries where conventional cutting methods are still predominant. Therefore, an automated plasma cutter if properly optimised would be an effective solution. CNC Plasma cutter with an automated torch height adjustment was used for this experiment to process a 0.6 mm thick deep drawing cold rolled DCO1 steel grade material. Tests were carried out varying the plasma parameters speed, pressure and intensity, the quality obtained was assessed. Three-dimensional Triplescan Atos model was used to measure the maximum surface deformation. Samples were sectioned, mounted, polished, mirrored and etched with 5% Nital acid to expose the material grains. Results were gathered on a tables, then Taguchi method and Analysis of Variance were used to optimise and analyse the parameters. Results showed an effective cut for thin materials. The optimal values obtained were 8000 mm/min, pressure 70 psi and Intensity 25 A for sheet deformation whereas heat affected zones was cutting speed 8500 mm/min, pressure 80 psi and Intensity 30 A. Cutting speed and intensity had the highest impact on deformation however heat affected zones was influenced mainly by the cutting speed. The study suggested also that a mathematical model can be constructed to predict the response for both phenomena and assess the relationship strength, the method used was least square error, the tests showed that the models fit adequately and can be trusted to predict new values. Lastly, a vehicle chassis was used for the test, the results showed an effective cutting on painted material, no second processing was required. Sealant under the material required removal on plasma pathway to avoid excess smoke or fire generation. An estimation was made for the underbody chassis cut out processing time and it was found that automated plasma can reduce the cycle time to just above 40 min.

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Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Cited by 28 publications

References 46 publications

Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

Experimental Investigation of Plasma Cutting Two Separate Thin Steel Sheets Simultaneously and Parameters Optimisation Using Taguchi Approach

Optimisation of cutting parameters and surface deformation during thin steel sheets plasma processing using Taguchi approach

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