2020
DOI: 10.1007/s00170-020-06262-1
|View full text |Cite
|
Sign up to set email alerts
|

Water-assisted femtosecond laser drilling of 4H-SiC to eliminate cracks and surface material shedding

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

1
11
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
7
1

Relationship

2
6

Authors

Journals

citations
Cited by 37 publications
(12 citation statements)
references
References 27 publications
1
11
0
Order By: Relevance
“…The slags affected the precision of the dimple size and the growth of nanotubes. To prevent this problem, processing the samples under vacuum conditions and utilizing water [70] , alcohol [71] , or other media during processing produces cleaning and cooling effects of liquids, which may help for high-quality processing.…”
Section: Discussionmentioning
confidence: 99%
“…The slags affected the precision of the dimple size and the growth of nanotubes. To prevent this problem, processing the samples under vacuum conditions and utilizing water [70] , alcohol [71] , or other media during processing produces cleaning and cooling effects of liquids, which may help for high-quality processing.…”
Section: Discussionmentioning
confidence: 99%
“…[1][2][3][4][5][6] The wide band gap, high limit operating temperature and thermal conductivity, high breakdown electric field strength, excellent oxidation and neutron irradiation resistance, corrosion and wear resistance, which makes SiC becoming promising material in harsh environment. [7][8][9][10] The thermal expansion coefficient and lattice constant of single-crystal SiC are similar to those of gallium nitride (GaN), which effectively solves the problem of low lattice matching between substrate materials and gallium nitride.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, the ablation threshold reduction is closely related to the liquid with different properties. In addition, Wang et al also prepared high-quality silicon carbide through-hole arrays without cracks and heat-affected zones by water-assisted femtosecond laser ablation technique, which is essential for the high-quality processing of silicon carbide electronic devices ( Wang et al, 2021 ).…”
Section: Introductionmentioning
confidence: 99%