ObjectiveThe aim of this study was to compare the polimerization ability of three
different light-curing units (quartz tungsten halogen, light-emitting diodes
and plasma arc) and their exposure modes (high-intensity and soft-start) by
determination of microhardness, water sorption and solubility, and diametral
tensile strength of 5 dual-curing resin cements. Material and methodsA total of 720 disc-shaped samples (1 mm height and 5 mm diameter) were
prepared from different dual-curing resin cements (Duolink, Nexus, Bifix-QM,
Panavia F and RelyX Unicem). Photoactivation was performed by using quartz
tungsten halogen (high-power and soft-up modes), light-emitting diode
(standard and exponential modes) and plasma arc (normal and ramp-curing
modes) curing units through ceramic discs. Then the samples (n=8/per group)
were stored dry in the dark at 37ºC for 24 h. The Vickers hardness
test was performed on the resin cement layer with a microhardness tester
(Shimadzu HMV). For sorption and solubility tests; the samples were stored
in a desiccator at 37ºC and weighed to a constant mass. The samples
were weighed both before and after being immersed in deionized water for
different periods of time (24 h and 7 days) and being desiccated. The
diametral tensile strength of the samples was tested in a universal testing
machine at a crosshead speed of 0.5 mm/min. Data were analyzed statistically
by nonparametric Kruskal Wallis and Mann-Whitney U tests at 5% significance
level. ResultsResin cement and light-curing unit had significant effects (p<0.05) on
microhardness, diametral tensile strength, water solubility and sorption.
However, no significant differences (p>0.05) were obtained with different
modes of LCUs. ConclusionThe study indicates that polymerization of resin cements with different
light-curing units may result in various polymer structures, and
consequently different mechanical and physical properties.